Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Sony Corporation

Ricoh Company, Ltd.

Technische Universitaet Chemnitz

Robert Boschgmbh

Joerg Froemel

Koichi Ikeda

Axel Franke

Thomas Gessner

Akira Akiba

Yukito Sato

Achim Trautmann

Maik Wiemer

Andreas Bertz

Christian Kaufmann

Steffen Kurth

Markus Nowack

Mario Baum

Holger Letsch

Lutz Hofmann

Joerg Braeuer

Stefan Leidich

Ando Feyh

Knut Gottfried

An electrostatically actuated micro-mechanical switching device with movable elements formed in the bulk of a substrate for closing and releasing at least one Ohmic contact by a horizontal movement of the movable elements in a plane of the substrate. The switching device has a drive with comb-shaped electrodes including fixed driving electrodes and movable electrodes. A movable push rod is mechanically connected with the movable electrodes, extends through the electrodes, has a movable contact element at one side, and at least one restoring spring. A signal line has two parts interrupted by a gap. The micro-mechanical switching device is in shunt-configuration with low loss, high isolation in a wide frequency range, low switching time at low actuation voltage and sufficient reliability. The line impedance of the signal line and its variation is as small as possible. The switching device is in shunt-configuration for closing and releasing the Ohmic contact between a ground line and the signal line. The contact element has a movable contact beam extending at least partially opposite to the signal line and being electrically and mechanically connected to both parts of the signal line, respectively. The ground line is formed with a contact bar that leads through the gap of the signal line for forming the Ohmic contact between the contact beam and the ground line. A contact metallization is provided at least on top and on the side walls of the contact beam, of the signal line and of the ground line.

Electrostatically actuated micro-mechanical switching device

A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A microsystem is formed from two bonding substrates and a construction lying between the bonding substrates, the construction having a reacted reactive layer system. The microsystem is a sensor coated with biomaterial and/or has elements composed of polymeric material and/or at least one magnetic and/or piezoelectric and/or piezoresistive component.

Microstructure with reactive bonding

A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in its height direction; a first wiring portion being connected with the functional element and extending from the airtightly sealed space to an outside thereof; a second wiring portion being different from the first wiring portion and extending from the step portion to an upper surface of the seal member; and a bump on the second wiring portion, in which the first wiring portion is bent towards the airtightly sealed space and connected via a photoconductive member with the second wiring portion on the step portion.

Functional element package and fabrication method therefor

Growing community of inventors

Chemnitz, Germany

Joerg Froemel