Micronas Gmbh

Tdk-micronas Gmbh

Robert Boschgmbh

Joerg Franke

Klaus Heberle

Timo Kaufmann

Joachim Ritter

Oliver Breitwieser

Thomas Leneke

Reiner Bidenbach

Dieter Baecher

Wolfgang Horn

Gilbert Alexander Erdler

David Muthers

Thilo Rubehn

Frank Hutter

Gert Umbach

Andreas Ring

Dietmar Koschella

Danny Stoll

Diane Wagner

Simon Selg

Christian Jung

A method for the transfer learning of hyperparameters of a machine learning algorithm. The method includes providing a current search space and a previous search space. A reduced search space is then created and candidate configurations are drawn repeatedly at random from the reduced search space and from the current search space, and the machine learning algorithm, parameterized in each case with the candidate configurations, is applied. A Tree Parzen Estimator (TPE) is then created as a function of the candidate solutions and the results of the machine learning algorithm parameterized with the candidate configurations, and the drawing of further candidate configurations from the current search space using the TPE is repeated multiple times, the TPE being updated upon each drawing.

Method and device for transfer learning between modified tasks

A magnetic field measuring device having a semiconductor body with a first surface running in an x-y plane, with a first and second magnetic field sensor disposed on the surface, and an axis of symmetry, which runs perpendicular to the first surface in the z-direction and to which the magnetic field sensors are positioned in a mirrored fashion, first and second magnets, which are spaced apart from one another and in each case have an axis and a polar surface running perpendicular to the axis and facing the semiconductor body. The magnetic polarity changes along the axes on a surface, whereby the axes run in the direction of the axis of symmetry, whereby the axis of symmetry runs between the axes of the magnets, whereby the surfaces of the magnets in each case are spaced apart in the z-direction to the first surface of the semiconductor body.

Magnetic field measuring device

A distance measuring device with two magnetic field sensors and a permanent magnet and a semiconductor body is provided. The device includes a monolithically integrated evaluation circuit, and a difference signal can be determined by means of the magnetic field sensors and provides an output signal as a result of the determination. The value of the output signal based on the neutralization of a magnetic-flux-free region is a function of a distance of a ferromagnetic sensing element from the two magnetic field sensors. The semiconductor body is arranged between U-shaped pole shanks of the magnet, which is magnetized in the X direction, wherein the first magnetic field sensor is arranged in an area located between two opposing shanks of the first pole, and the second magnetic field sensor is arranged in an area located between two opposing shanks of the second pole.

Distance measuring device

A packaged IC component having a semiconductor body and a printed circuit board. The semiconductor body includes a monolithically integrated circuit and at least two metal contact areas. The printed circuit board has a first and second region and a top and a bottom. At least two formed terminal contacts and two conductive traces are connected to the terminal contacts, and the terminal contacts are designed as contact holes passing through the printed circuit board, and are arranged in the first region of the printed circuit board. The two metal contact areas are connected to the conductive traces by bond wires, and the semiconductor body is implemented as a die. The die is arranged in the second region on the top of the printed circuit board, and the semiconductor body and the bond wires are completely covered with a potting compound on the top of the printed circuit board.

Packaged IC component

A measuring system having a magnetic device for generating a magnetic field and at least one magnetic field sensor for detecting a flux density of the magnetic field, at least in a first spatial direction. The magnetic device has a top side facing the magnetic field sensor, the magnetic field sensor is spaced apart from the top side of the magnetic device, the magnetic device has a main magnet, having two poles, with a main magnetizing direction for generating a main magnetic field and at least one secondary magnet, having two poles, with a secondary magnetization direction for generating a secondary magnetic field, the main magnet has larger dimensions than the at least one secondary magnet, the magnetic field is formed by superposition of the main magnetic field and the secondary magnetic field, the secondary magnetic field at least partially compensates the main magnetic field in the first spatial direction.

Measuring system

A calibration method for a Hall sensor having a Hall sensitive layer with four electrical contacts and a first field plate, wherein, at a first temperature and at a first magnetic flux density, a resistance value of the Hall sensitive layer is determined for each of at least three different field plate voltages present at the field plate, a calibration curve is produced from the at least three resistance values, a deviation value of the calibration curve is determined from a reference calibration curve, and the field plate voltage that is present at the first field plate or an operating voltage that is present at the sensitive layer is readjusted by a correction value corresponding to the deviation value.

Calibration method for a hall effect sensor

A measuring system for determining the position of a transducer along a z-direction, having a semiconductor body having a surface, a back surface, at least one connection contact and at least one magnetic field sensor which is sensitive in the z-direction, a carrier having a front side, rear side and electrically conductive regions, a magnet for producing a magnetic field, having a first magnetic pole formed along a first surface and an axis of symmetry extending perpendicular to the first surface, wherein between at least one connection contact of the semiconductor body and at least one conductor track of the carrier, there is an electrical operative connection, the first surface of the magnet being arranged parallel to the z-direction and the axis of symmetry of the magnet being arranged perpendicular to the z-direction, the transducer having an end face facing the magnetic field sensor.

A position determining sensor unit having a number of sensors arranged at predetermined positions along a path, and a transducer. The transducer has a first end which is moveable at least along the entire path, and a length running parallel to the path. Each sensor has a first supply voltage connection, a second supply voltage connection and a switching output, and wherein the switching output is switched into an On-state or an Off-state as a function of the threshold value of a sensor signal being exceeded or undershot. The supply voltage connection of each sensor is connected to a supply voltage, and a first sensor is arranged at a beginning of the path and a last sensor is arranged at an end of the path so that the second supply voltage connection of the first sensor is connected to a reference potential and the first sensor has a power consumption.

Position determining sensor unit

Magnetic field compensation device having a first bar-shaped flux concentrator and a second bar-shaped flux concentrator, wherein the first flux concentrator and the second flux concentrator are separated from one another in a y-direction, and the longitudinal axis of the first flux concentrator and the longitudinal axis of the second flux concentrator are arranged to be substantially parallel to one another. A control unit is in an operative electrical connection with the magnetic field sensor and the compensating coil, and the control unit is equipped to control the compensating current through the compensating coil using a measured signal from the magnetic field sensor in such a manner that, for an external magnetic field formed in the x-direction at the location of the magnetic field sensor, the magnetic field is substantially compensated.

Magnetic field compensation device

A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.

Test matrix adapter device

A position determining unit is provided that has a number of sensor units arranged at positions along a path, and a transducer. Each sensor unit has a carrier, a first and second supply voltage connection, a switching output, a measuring unit and a bias magnet comprising two poles. The measuring unit is arranged on the carrier and has at least one magnetic field sensor, wherein the switching output is switched into an On or Off-state as a function of a threshold value exceeding or falling short of a sensor signal. The first supply voltage connection of each sensor unit is connected to a supply voltage, wherein a first sensor unit is arranged at a beginning of the path and a last sensor unit is arranged at the end of the path. The second supply voltage connection of the first sensor unit is connected to a reference potential.

Position determining unit

An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.

Electrical component package with surface leads

An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.

IC package

A sensor device for suppressing a magnetic stray field, having a semiconductor body with a surface, formed in an x-y plane, and a back surface. Each circle half of a disk-shaped magnet has two magnetic poles and the magnet is rotatable relative to the IC housing around a z-direction. An imaginary lengthening of the axis penetrates the magnet in the center of gravity of the main extension surface of the magnet. A first pixel cell and a second pixel cell are integrated into the surface of the semiconductor body together with a circuit arrangement, and each pixel cell has a first magnetic field sensor and a second magnetic field sensor. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the first pixel cell in a projection along an imaginary lengthening of the axis is arranged within the two inner circle segments.

Sensor device

A sensor device is provided for suppressing a magnetic stray field, having a semiconductor body with a surface formed in an x-y plane, the x-direction and the y-direction are formed orthogonal to one another, and the sensor device has a first pixel cell and a second pixel cell integrated into the surface of the semiconductor body. A first magnetic field sensor detects a magnetic field in the x-direction and a second magnetic field sensor detects a magnetic field in the y-direction. The two pixel cells in a projection along an imaginary lengthening of the axis are arranged at an edge or next to an extension of the magnet in the x-y plane.

Growing community of inventors

Freiburg, Germany

Joerg Franke