Lumileds LLC

Joerg Feldmann

Hans-Helmut Bechtel

Jens Meyer

Ronja Missong

Antonio Lopez-Julia

Marinus Johannes Petrus Maria Van Gerwen

Marcel Van Gerwen

Marcel Rene Bohmer

Yu-Chen Shen

Matthias Heidemann

Petra Huppertz

A light emitting device and method of forming a light emitting device are disclosed. The light emitting device includes a light emitting diode and a phosphor layer formed on the light emitting diode, the phosphor layer including a plurality of phosphor particles formed in a particle layer, the particle layer including interstices between the phosphor particles, and a matrix material disposed in a portion of the interstices. A plurality of cavities may be disposed in a remaining portion of the interstices.

Ultra-thin phosphor layers partially filled with Si-based binders

An optical coupling structures are disposed on light output surfaces of semiconductor LEDs of a miniLED or microLED array to facilitate coupling of light emitted by the semiconductor LEDs through the light output surfaces. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LEDs.

Optical coupling layer to improve output flux in LEDs

Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 &#x3bc;m and less than 10 &#x3bc;m.

Phosphor layer for micro-LED applications

A particle layer is positioned over a light output surface of a light emitting diode. A transparent protection layer positioned between and in contact with the light output surface and the particle layer. The particle layer comprises a multitude of optically scattering or luminescent particles and a thin coating layer of transparent material coating particles of the multitude. The particles are characterized by a D50 greater than about 1.0 &#x3bc;m and less than about 30. &#x3bc;m; the coating layer has a thickness less than about 0.20 &#x3bc;m. The protection layer is less than about 0.05 &#x3bc;m thick and includes one or more materials different from material of the coating layer. The protection and coating layers can each include one or more metal or semiconductor oxides. Oxide precursor reactivities, with respect to the corresponding light output surface, are less for protection layer material than for coating layer material.

Protection layer for a light emitting diode

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Aachen, Germany

Joerg Feldmann