Infineon Technologies Ag

Infineon Technologies Austria Ag

Joerg Busch

Matthias Stecher

Bernhard Weidgans

Johann Gatterbauer

Renate Hofmann

Hermann Gruber

Michael Nelhiebel

Klaus Goller

Rainer Pelzer

Norbert Mais

Marianne Kolitsch

Katrin Albers

A semiconductor device includes a structured interlayer on a substrate, a structured power metallization on the structured interlayer, and a barrier on the structured power metallization. The barrier is configured to prevent diffusion of at least one of water, water ions, sodium ions, potassium ions, chloride ions, fluoride ions, and sulphur ions towards the structured power metallization. A first defined edge of the structured interlayer faces the same direction as a first defined edge of the structured power metallization and extends beyond the first defined edge of the structured power metallization by at least 0.5 microns. The structured interlayer has a compressive residual stress at room temperature and the structured power metallization generates a tensile stress at room temperature that is at least partly counteracted by the compressive residual stress of the structured interlayer. The first defined edge of the structured power metallization has a sidewall which slopes inward.

Barrier for power metallization in semiconductor devices

A method includes producing a semiconductor arrangement having a semiconductor layer, a first insulation layer arranged on the semiconductor layer and facing a first surface of the semiconductor arrangement, and an insulating via extending in a vertical direction through the semiconductor layer as far as the first insulation layer, the insulating via surrounding a region of the semiconductor layer in a ring-shaped fashion. The method further includes permanently securing a first carrier to the first surface of the semiconductor arrangement.

Method for stabilizing a semiconductor arrangement

A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.

Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement

A power semiconductor IC device is disclosed. In one embodiment, the device includes a substrate, and a layer structure formed on the substrate. The layer structure includes a metallization layer including copper, wherein the metallization layer is formed as a stack structure including at least two copper layers and a stabilization layer between the two copper layers.

Metallization layer for a power semiconductor device

Semiconductor components having a semiconductor body which includes a semiconductor base surface have to be sealed with a molding compound in order to protect against moisture or heat. Mechanical interlocking of the molding compound to the semiconductor base surface is achieved by means of at least one interlocking structure. This may be either a horizontal interlocking structure for mechanically interlocking the molding compound to the semiconductor base surface in the direction which is horizontal with respect to the semiconductor base surface and/or a vertical interlocking structure for mechanically interlocking the molding compound to the semiconductor base surface in the direction which is vertical with respect to the semiconductor base surface.

Growing community of inventors

Wuppertal, Germany

Joerg Busch