International Business Machines Corporation

Purdue Research Foundation

Forschungszentrum Julich Gmbh

Joerg Appenzeller

Phaedon Avouris

Richard Martel

Kevin K Chan

Hon-Sum Philip Wong

Philip G Collins

Supratik Guha

Emanuel Tutuc

Yu-Ming Lin

Edward J Nowak

Richard Quimby Williams

Feng Zhang

Aj KleinOsowski

Yuqi Zhu

Alejandro Gabriel Schrott

James Anthony Misewich

Albert V Davydov

Joachim Knoch

Leonid A Bendersky

Sergiy Krylyuk

Aj Kleinosowski

Saptarshi Das

Huairuo Zhang

Hong-yan Chen

Hon-Sum Philip Stanford University Wong

A method of switching a phase-change device (Device), including changing phase of the Device from a semiconducting 2H phase to a new 2Hphase with a higher conductivity, the Device having an active material with a thickness including a phase transition material to thereby transition the Device from a high resistive state (HRS) to a low resistive state (LRS) by application of a set voltage and further to return the Device from the LRS back to the HRS by application of a reset voltage.

Phase transition based resistive random-access memory

A resistive random access memory (Device) is disclosed. The Device includes a substrate, a first electrode formed atop the substrate, a tunneling barrier layer formed atop the first electrode, an active material formed atop the tunneling barrier layer, an isolation layer formed atop the active material, and a second electrode formed atop the isolation layer, the first electrode and the second electrode provide electrical connectivity to external components, where the active material is a phase change material which undergoes phase transition in the presence of an electric field, Joule heating, or a combination thereof.

Illustrative embodiments provide a FETRAM that is significantly improved over the operation of conventional FeRAM technology. In accordance with at least one disclosed embodiment, a CMOS-processing compatible memory cell provides an architecture enabling a non-destructive read out operation using organic ferroelectric PVDF-TrFE as the memory storage unit and silicon nanowire as the memory read out unit.

Organic ferroelectric material based random access memory

A frequency tripler device is disclosed. The frequency tripler device includes a first graphene based field effect transistor (FET) of a first dopant type, having a gate, a drain, and a source, and a second graphene based FET of a second dopant type, having a gate, a drain, and a source, the gate of the first FET coupled to the gate of the second FET and coupled to an input signal having an alternating current (AC) signal of a first frequency, the combination of the first and second FETs generates an output signal with a dominant AC signal of a frequency of about three times the first frequency.

Graphene-based frequency tripler

A semiconductor structure is provided, which includes multiple sections arranged along a longitudinal axis. Preferably, the semiconductor structure comprises a middle section and two terminal sections located at opposite ends of the middle section. A semiconductor core having a first dopant concentration preferably extends along the longitudinal axis through the middle section and the two terminal sections. A semiconductor shell having a second, higher dopant concentration preferably encircles a portion of the semiconductor core at the two terminal sections, but not at the middle section, of the semiconductor structure. It is particularly preferred that the semiconductor structure is a nanostructure having a cross-sectional dimension of not more than 100 nm.

Semiconductor nanostructures, semiconductor devices, and methods of making same

A self-aligned carbon-nanotube field effect transistor semiconductor device comprises a carbon-nanotube deposited on a substrate, a source and a drain formed at a first end and a second end of the carbon-nanotube, respectively, and a gate formed substantially over a portion of the carbon-nanotube, separated from the carbon-nanotube by a dielectric film.

Method of fabricating self-aligned nanotube field effect transistor

Gate electrodes are formed on a semiconducting carbon nanotube, followed by deposition and patterning of a hole-inducing material layer and an electron inducing material layer on the carbon nanotube according to the pattern of a one dimensional circuit layout. Electrical isolation may be provided by cutting a portion of the carbon nanotube, forming a reverse biased junction of a hole-induced region and an electron-induced region of the carbon nanotube, or electrically biasing a region through a dielectric layer between two device regions of the carbon nanotube. The carbon nanotubes may be arranged such that hole-inducing material layer and electron-inducing material layer may be assigned to each carbon nanotube to form periodic structures such as a static random access memory (SRAM) array.

Carbon nanotube based integrated semiconductor circuit

Self-aligned nanotube field effect transistor

A method of fabricating a nanotube field-effect transistor having unipolar characteristics and a small inverse sub-threshold slope includes forming a local gate electrode beneath the nanotube between drain and source electrodes of the transistor and doping portions of the nanotube. In a further embodiment, the method includes forming at least one trench in the gate dielectric (e.g., a back gate dielectric) and back gate adjacent to the local gate electrode. Another aspect of the invention is a nanotube field-effect transistor fabricated using such a method.

Method and apparatus for fabricating a carbon nanotube transistor

Core-shell nanowire transistor

Growing community of inventors

Valhalla, NY, United States of America

Joerg Appenzeller