Infineon Technologies Ag

Joerg Adler

Uwe Hoeckele

Reinhard Goellner

Christof Jalics

Walter Preis

Sandra Obernhuber

Patricia Nickut

Tanja Schest

Tanja Ippisch

A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.

Method for manufacturing a device on a substrate

Growing community of inventors

Wuppertal, Germany

Joerg Adler