Nxp B.v.

Nexperia B.v.

Adeia Semiconductor Bonding Technologies Inc.

Joep Stokkermans

Thomas Markus Kampschreur

Arjan Franklin Bakker

Piet Van Der Meer

Antonius Hendrikus Jozef Kamphuis

Johannes Wilhelmus Dorotheus Bosch

Piet Christiaan Jozef Van Rens

Tom Kampschreur

Arnoldus J C B De Vet

Wilhelmus Johannus Theodorus Derks

Leon Wetzels

Arnoldus Jacobus Cornelis Bernardus De Vet

Patrick Houben

Jasper Wesselingh

Nailia Nasibulina

Piet C J Van Rens

Gijs Van Der Veen

Johannes W D Bosch

Wilhelmus J T Derks

Antonius H J Kamphuis

The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.

Curved wafer stage

The disclosed device includes a single electric motor for linear and rotary movement with a stator. The stator includes a multi-phase coil arrangement with a plurality of coils or coil sets and a rotor. The rotor is movable in an axial direction of a rotational axis thereof and includes a plurality of poles respectively with at least one permanent magnet The device further includes a control unit operative to determine currents (I, I, I) by calculation formulas and based on at least a number of coils or coil sets of the plurality of coils or coil sets, and an angle of rotation of said rotor and a parameter depending on an axial position of the rotor. Each current (I, I, I) has a current component (I, I, I) for generating a torque and a current component (I, I, I) for generating an axial force, and to supply the determined currents in open loop to the number of coils or coil sets, so that the sum of the currents is zero. Further, at least one of the stator and the rotor, includes a back-iron.

Device, apparatus and system

A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Wirebonding method and apparatus

In a chip transferring apparatus a wafer () and a lead frame () are positioned. A first chip () is picked up from the wafer () by a transfer head (-) in a chip pick-up position, while bonding a second chip to the lead frame () by another transfer head in a chip bonding position. The first chip () is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip () is bonded on the lead frame () by said one of the transfer heads (-) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer () in the chip pick-up position. Each transfer head (-) comprises a collet (-) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections () in a transfer assembly stator () communicating through a gap () between the rotatable transfer assembly () and the transfer assembly stator () with gas ducts in the transfer head (-) and the corresponding collet (-). A chip () is picked up from a wafer () by a needle mechanism ().

Chip transfer method and apparatus

A gravity compensation device partially or completely compensates a force exerted by a basic mass () on a balancing device () at a first distance from an axis of rotation () by using a force generating device, such as spring (), exerting a counterforce on the balancing device at a second distance from the axis of rotation. The first distance, the second distance, or both are selectable for providing the desired gravity compensation. One or more pulleys with an angle-variable radius may be used. The gravity compensation device does not add substantial mass to the basic mass, and is simple in design.

Gravity compensation device for a chip transfer apparatus

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Nijmegen, Netherlands

Joep Stokkermans