Seagate Technology Incorporated

Joel William Hoehn

Raymond Leroy Moudry

Andrew D Habermas

Mihaela Ruxandra Baurceanu

Zubair Ahmed Khan

Marc Ronshaugen

Lance Eugene Stover

John West Dykes

Jianxin Zhu

James E Angelo

Gordon Merle Jones

Yuhong Xiong

Dat Quach

William D Mosley

Zine-Eddine Boutaghou

Kurt W Wierman

Brian William Karr

Kevin Jon Schulz

David Allen Sluzewski

Andreas Argyros Polycarpou

Andrew Joseph Boyne

Ricky Ray Anderson

Daniel Richard Buettner

Chea Phann

Kevin Lambert Mayer

Amy Jo Bergerud

Mark Allen Herendeen

Pramit P Parikh

Michael C Kautzky

Declan Macken

Jing Gui

Dallas W Meyer

Bruno Jean Marchon

Peter Raymond Segar

Mark James Schaenzer

Ramesh Sundaram

Sarbeswar Sahoo

Daniel Paul Burbank

Dian Song

Huan H Tang

John L Brand

Edwin F Rejda

Mary Cynthia Hipwell

Harry Sam Edelman

Shanlin X Hao

Dale E Egbert

David Gerard Wobbe

Peter John Gunderson

Roger L Hipwell

Subrahmanyan Nagarajan

Jeffery K Berkowitz

Christopher Loren Platt

Kristin Joy Duxstad

Jeff O'Konski

William Omar Liners

Yongping Gong

James Richard Peterson

Leping Li

Jeffrey Robert O'Konski

Mei-Ling Wu

Kevin Lamber Mayer

Todd Arthur Luse

Richard T Greenlee

John L Ibele

Edward Alan Knutson

Kara L Maytag

Paul E Gallup

Saravuth Keo

Vishwanath Ramaswamy

Albert Enrique Singh

Yeoh Hooi Sze

Ng Kok Cheong

Joe J Schobel

Ralph Marquart

Fang Chen

Cyril Peter DeVries

Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Adhesive for processing a microelectronic substrate, and related methods

The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making

The present disclosure includes methods of using a sacrificial, protective head overcoat during the manufacture of sliders. In some embodiments, the final trailing edge topography of the transducer devices is formed before applying the sacrificial, protective head overcoat. In some embodiments, the final trailing edge topography of the transducer devices is formed after removing the sacrificial, protective head overcoat.

Method of forming one or more sliders

Methods of manufacturing one or more sliders, and related sliders

Embodiments of the present disclosure include carriers for a row bar or stack of row bars to be lapped. In some embodiments, the ratio of the coefficient of thermal expansion of at least the bridge of a carrier to the coefficient of thermal expansion of the slider row bar or stack of slider row bars is less than 1.6. In some embodiments, a carrier can include a bridge having a length longer than the row bar or stack of row bars. In some embodiments, one or more bridge bending members can have junction centerlines offset from the corresponding bridge bending members.

Carrier for mounting a bar of sliders or a stack of such bars to be lapped

Disclosed herein are embodiments of a method of making a lubricant composition for lapping a ceramic material. The method includes mixing a base lubricant component and a powdered wax composition component to form the lubricant composition. The powdered wax composition component includes a powdered wax dispersion or a powdered wax emulsion. The amount of powdered wax composition component mixed with the base lubricant component is from 0.01 to 10 percent by weight of the lubricant composition. Also disclosed herein are embodiments of related lubricant compositions and/or methods of using the lubricant to lap a ceramic substrate (e.g., one or more bars of sliders).

Lubricant composition for lapping ceramic material, and related methods

The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

Lapping plate and method of making

The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

One or more slider bars are attached to at least one component of a multi-component carrier device. The multi-component carrier device is attached to a lapping arm of a lapping machine and the one or more slider bars attached to the carrier device are lapped. The at least one component of the multi-component carrier device is attached to a grinding/cutting machine. At least one of a grinding operation or a cutting operation is performed on the one or more slider bars.

Method and assembly for grinding and/or cutting a slider bar on a lapping carrier

A slider bar extender to removably connect one or more slider bars to a processing machine or tool is disclosed. In illustrated embodiments, the extender is coupled to a holder structure through a tongue and groove connection. In illustrated embodiments, the tongue is formed on the holder structure and the groove is formed on the extender. In illustrated embodiments, the extender includes a plurality of reduced thickness strips. The reduced thickness strips are orientated lengthwise to control or transfer bending to one or more bars connected to a proximal edge surface of the extender.

Lapping assembly or process utilizing a bar stack extender

An assembly includes a carrier device having proximal and distal ends. The carrier device includes a workpiece platform along the proximal end. The workpiece platform supports one or more slider bars. The carrier device attaches to a lapping machine. An adaptive component, including at least one spring, has a first portion that couples to the carrier device and a second portion that couples to a grinding-slicing machine.

Universal carrier device and adaptive components for the carrier device

A method of forming a patterned lapping plate by providing a working tool having a pattern comprising a plurality of raised teeth, each of the raised teeth having a base, at least one side wall, and a terminal end, and patterning the lapping plate with the tool to provide a working surface having an inverse pattern of the tool surface in the working surface of the lapping plate, the patterning process plastically deforming the working surface of the lapping plate.

Method of patterning a lapping plate, and patterned lapping plates

Growing community of inventors

Hudson, WI, United States of America

Joel William Hoehn