E.i. Dupont De Nemours and Company

Joel Slutsky

Jay Robert Dorfman

Vincent P Siuta

William H Morrison, Jr

Brian D Veeder

Thomas Lin

The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.

Device chip carriers, modules, and methods of forming thereof

A silver composition is disclosed which contains silver powder or flake, a water soluble binder, an organic water soluble solvent and an inorganic binder. Generally, the composition will also contain water. The water soluble binder is especially chosen such that it has the property after dissolution in water, followed by water removal that it can be again dissolved in water (as opposed to water resistance as in a paint). The silver composition as a film or coating also lacks water resistance (prior to a firing operation) which can aid in pattern formation.

Water cleanable silver composition

Thick film conductor compositions comprising finely divided particles of copper oxide-coated copper and low softening point inorganic binder dispersed in a low-resin organic medium. Additional copper oxide is incorporated into the composition by either direct addition or by inclusion in the inorganic binder.

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Durham, NC, United States of America

Joel Slutsky