Rf Micro Devices, Inc.

Motorola Corporation

Joel Robert Gibson

Marnie Ann Knadler

Scott Yoder

Darrell G Epperson

Robert O Wagner

Ryan Bosley

Michael S LaBelle

Carlos Gamero

Scott D McCall

A power amplifier configuration including power amplifier circuitry and power control circuitry and having improved Power Added Efficiency (PAE) is provided. The power amplifier circuitry includes one or more input amplifier stages in series with a final amplifier stage. The power control circuitry provides a variable supply voltage to the input amplifier stages based on an adjustable power control signal. The final amplifier stage is powered by a fixed supply voltage. In operation, as output power of the power amplifier is reduced from its highest power level, the variable supply voltage is reduced. Accordingly, RF power of an amplified signal provided to the final amplifier stage from the input amplifier stages decreases, and the final amplifier stage transitions from saturation to linear operation, thereby increasing the gain of the final amplifier stage. Thus, a desired output level can be maintained while operating at lower current levels.

Power amplifier control technique for enhanced efficiency

The present invention integrates an inductor into a semiconductor package by integrally forming inductive segments in the leadframe. The inductive segments may be connected directly to a lead of the leadframe, or indirectly to a lead or a bond pad on a semiconductor die via wirebonds to form an inductor. The inductance value for the resultant inductor is typically controlled by the point of contact for the wirebonds or the leads about the inductive segment. The inductance values may also be controlled by the shape and size of the inductive segments. The leadframe may be formed to support multiple inductive segments, and one or more configurations, including those using one or more die flags to support a like number of semiconductor die.

Leadframe inductors

An electronic device (100) has a heatsink (116) and electrical contacts (120) which are originally all part of a support frame (200). After assembly, the border of the support frame (202) is broken off, thereby electrically isolating the electrical contacts (120) from one another, and from the heatsink (116). The electrical contacts (120) and the heatsink (116) are coplanar. In one version, the electrical contacts (120) do not extend past the circuit board (102) of the device (100).

Electronic device having coplanar heatsink and electrical contacts

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Chandler, AZ, United States of America

Joel Robert Gibson