Tokyo Electron Limited

Therma-Wave, Inc.

Joel Ng

Sergey Alexandrovich Voronin

Yan Chen

James Lee Hendrix

Ying Zhu

Blaze Messer

Ashawaraya Shalini

Da Song

David S Wang

Michael A Ellison

Vi Vuong

Andrej Mitrovic

Xinkang Tian

David M Aikens

Lawrence D Rotter

Ching-Ling Meng

Mihail Mihaylov

David Y Wang

Zheng Yan

Jason Ferns

Badru D Hyatt

A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of the plasma processing chamber for a first time duration; and after the first time duration, determining a process endpoint by: while exposing the substrate to the plasma by applying the first power to the first electrode, applying a second power to a second electrode of the plasma processing chamber for a second time duration that is shorter than the first time duration; and obtaining an optical emission spectrum (OES) from the plasma while applying the second power to the second electrode, where an energy of the second power over the second time duration is less than an energy of the first power over a sum of the first and the second time durations by a factor of at least 2.

Method for OES data collection and endpoint detection

A method of characterizing a plasma in a plasma processing system that includes: generating a pulsed plasma in a plasma processing chamber of the plasma processing system, the pulsed plasma being powered with a pulsed power signal, each pulse of the pulsed plasma including three periods: a overshoot period, a stable-ON period, and a decay period; performing cyclic optical emission spectroscopy (OES) measurements for the pulsed plasma, the cyclic OES measurements including: obtaining first OES data during one of the three periods from more than one pulses of the pulsed plasma; and obtaining a characteristic of the pulsed plasma for the one of the three periods based only on the first OES data.

Optical emission spectroscopy for advanced process characterization

A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of a plasma processing chamber; turning OFF the first power to the first electrode after the first time duration; while the first power is OFF, applying a second power to a second electrode of the plasma processing chamber for a second time duration, the second time duration being shorter than the first time duration, an energy of the second power over the second time duration is less than an energy of the first power over the first time duration by a factor of at least 2; and detecting an optical emission spectrum (OES) from species in the plasma processing chamber.

Time-resolved OES data collection

An advanced optical sensor and method for detection of optical events in a plasma processing system. The method includes detecting at least one light emission signal in a plasma processing chamber. The at least one detected light emission signal including light emissions from an optical event. The method further includes processing the at least one light emission signal and detecting a signature of the optical event from the processed light emission signal.

Advanced optical sensor and method for detecting an optical event in a light emission signal in a plasma chamber

A combiner for optical beams includes a substrate overlaid by a multi-layer dielectric film stack. The substrate is a clear material and the dielectric film stack is a series of alternating layer of high and low refractive index. This gives the combiner relatively high reflectivity across UV wavelengths and relatively high transmissivity in the visible and longer wavelengths and allows visible light to pass through the combiner while UV light is reflected. At the same time dielectric film stack has minimal absorption and scatter. This means that the intensity of visible light maintains at least 90% of its intensity as it passes through combiner and UV light retains at least 90% of its intensity as it is reflected by combiner.

Beam splitter/combiner for optical metrology tool

A flat spectrum illumination source for use in optical metrology systems includes a first light source generating a visible light beam and a second light source generating an ultraviolet light beam. The illumination source also includes an auxiliary light source generating a light beam at wavelengths between the visible light beam and the ultraviolet light beam. The three light beams are combined to provide a broadband probe beam that has substantially even illumination levels across a broad range of wavelengths. Alternately, the illumination source may be fabricated as an array of light emitting diodes selected to cover a range of separate wavelengths. The outputs of the LED array are combined to produce the broadband probe beam.

Flat spectrum illumination source for optical metrology

Beam splitter/combiner for optical meterology tool

Growing community of inventors

San Leandro, CA, United States of America

Joel Ng