Intel Corporation

Altera Corporation

Joel Martinez

Jon M Long

Sergey Yuryevich Shumarayev

Weiqi Ding

Mike Peng Li

David Wolk Mendel

Peng T Li

Curt Wortman

Peng Li

A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.

Integrated circuit package with electro-optical interconnect circuitry

The present disclosure relates to modular transceiver-based network circuitries that may include internal configurable interfaces or gaskets. The configurable gaskets may facilitate integration of the network circuitries in electronic devices by providing a transparent interface to processing circuitries coupled to the network circuitries. Moreover, the configurable gaskets may also have a floorplan layout (e.g., a chiplet layout) that may facilitate coupling of multiple network circuitries to a single processing circuitry, in a modular manner.

Universal transceiver container

Systems and methods are provided to improve flexibility of optical signal transmission between integrated circuit devices, and more specifically data utilization circuits. More specifically, the integrated circuit devices may include a data utilization circuit communicatively coupled to a field programmable optical array (FPOA). In some embodiments, the FPOA may convert an electrical signal received from the data utilization to an optical signal, route the optical signal to an optical channel, and multiplex the optical signal with other optical signals routed to the optical channel. Additionally or alternatively, the FPOA may de-multiplex a multiplexed optical signal based on wavelength, route an optical signal included in the multiplexed optical signal to an electrical channel, convert the optical signal into an electrical signal, and output the electrical signal to the data utilization circuit via an electrical channel. In some embodiments, the FPOA may improve flexibility by performing such functions without reconfiguring the data utilization circuit.

Integrated circuit device with field programmable optical array

Growing community of inventors

Hayward, CA, United States of America

Joel Martinez