Applied Materials, Inc.

Energetic Materials & Products, Inc.

Nexx Systems Packaging, LLC

Led Illumination Holdings Llc,

Joel Brad Bailey

Reginald Hunter

John Granier

Lawrence J Overzet

Steven E Gianoulakis

Marwan H Khater

Frank Christian Doughty

Siva K Kanakasabapathy

Darryl Bennett

John J Festa

Austin Paynter

Stephen J Barcik

William J Kernion

An underwater firearm is disclosed. The underwater firearm includes a barrel for receiving an ammunition on a first end and a barrel cap for covering a second end of the barrel. The underwater firearm also includes a capsule having a firing pin and contains a reactive material. The reactive material can be ignited by an electrical ignitor in order to propel the firing pin to strike the ammunition. A housing is utilized to contain the capsule and the electrical ignitor.

Firearm for unmanned underwater vehicles

A shot shell is disclosed. The shot shell includes a casing, a projectile, a cushion wad having a sabot, a propellant, and a primer for igniting the propellant. The projectile, the cushion and the propellant are contained within the casing. The projectile includes a reactive material pellet that is partially covered by a taper-shaped inert capsule.

Reactive shot shell for breaching barriers

Embodiments of the invention generally provide a method for enhancing chemical reactions within a substrate processing chamber during a substrate processing sequence. The method generally includes supporting a substrate in a face up position on a substrate support member, providing a process gas into the processing chamber, and striking a plasma of the process gas. The method further includes imparting at least one impulse to the substrate support member that is substantially perpendicular to a substrate surface, the at least one impulse being of sufficient magnitude to agitate the substrate surface to expand an exposed surface area of the substrate surface.

Method for enhancing substrate processing

Embodiments of the invention provide a method for removing contaminant particles from a substrate surface, where the method includes supporting a substrate in a face up position on a substrate support member and imparting a broadband impulse to the substrate support member in a direction that is substantially perpendicular to a surface of the substrate. The broadband impulse applied to the substrate support is calculated to be of sufficient magnitude to dislodge contamination particles from the surface of the substrate. The method further includes removing dislodged particles from an area proximate the substrate surface.

Method for removing contamination particles from substrates

Embodiments of the invention provide an improved method and apparatus for sensing position and/or status of an object. For one embodiment, a method generally includes illuminating the object with an optical pulse source and supplying a first optical pulse to a photo-detector, causing a resonant circuit formed by the photo-detector and an inductor to generate a resonant signal. The method also includes supplying at least a second optical pulse to the photo-detector causing a change in the resonant signal, wherein the second optical pulse is reflected from the object, monitoring the change in the resonant signal, and determining a position of the object based on the monitored change in the resonant signal. A velocity, direction of travel and/or acceleration of the object may also be determined from successive position measurements.

Ultra low cost position and status monitoring using fiber optic delay lines

Embodiments of the invention generally provide a processing system for removing contaminant particles from substrates. The processing system generally includes at least one processing enclosure having a particle removal assembly positioned therein. The particle removal assembly generally includes a substrate support member, a broadband actuator in communication with the substrate support member, and an air knife assembly positioned proximate the substrate support member. The air knife assembly is generally configured to generate a high pressure laminar flow of gas across the surface of the substrate. The processing system further includes a substrate transfer enclosure in communication with each of the at least one processing enclosures, at least one substrate supply source in communication with the substrate transfer chamber, and at least one transfer robot positioned in the substrate transfer enclosure, the transfer robot being configured to transfer substrates between the at least one substrate supply source and the at least one processing enclosure.

Factory interface particle removal platform

Embodiments of the invention generally provide a multistage semiconductor processing tool, wherein the processing tool includes a first transfer chamber having a first substrate transfer robot positioned therein and at least one load lock chamber in communication with the first transfer chamber. The at least one load lock is generally configured to communicate substrates into and out of the first transfer chamber. Further, the processing tool includes at least one substrate cleaning chamber positioned in communication with the first transfer chamber. The at least one substrate cleaning chamber generally includes a substrate support member, a broadband actuation device in communication with the substrate support member, and a particle removal device configured to sweep away dislodged particles from an area proximate the substrate surface. The processing tool further includes a second transfer chamber having a second substrate transfer robot positioned therein, the second transfer chamber being in selective communication with the first transfer chamber, and at least one substrate processing chamber in communication with the second transfer chamber.

Processing platform with integrated particle removal system

Embodiments of the invention generally provide an apparatus for removing particles from a substrate surface, wherein the apparatus includes a substrate support member configured to support a substrate thereon, and a broadband actuator in mechanical communication with the substrate support member. Additionally, an air knife assembly may be positioned proximate a perimeter of the substrate surface, and is configured to deliver a laminar stream of air across the substrate surface in order to remove the dislodged contamination particles therefrom. Alternatively, a plasma source may be used to remove dislodged particles from the area proximate the substrate surface.

Particle removal apparatus

A method and apparatus for cleaning semiconductor wafers, next generation lithography (NGL) masks, and optical photomasks as well as test wafers and in service NGL and optical masks is disclosed. The method and apparatus utilize reactive gases and gas mixtures and mechanical agitation to enhance particle removal. The addition of a reactive gas process to an inert gas feed enhances the plasma cleaning process by breaking chemical bonds which form between surface particles and a substrate, consequently improving cleaning efficiency.

Particle contamination cleaning from substrates using plasmas, reactive gases, and mechanical agitation

A method and apparatus for integrating multipolar confinement with permanent magnetic electron cyclotron resonance plasma sources to produce highly uniform plasma processing for use in semiconductor fabrication and related fields. In a preferred embodiment, the plasma processing apparatus includes a vacuum chamber, a workpiece stage within the chamber, a permanent magnet electron cyclotron resonance plasma source directed at said chamber, and a system of permanent magnets for plasma confinement about the periphery of said chamber. The permanent magnets for plasma confinement are arranged in a multiplicity of rings with the plane of the rings perpendicular to the vacuum chamber axis and to the direction of propagation of the microwave into the vacuum chamber. The number of rings is chosen with respect to the vacuum chamber dimensions to produce a large, low magnetic field region in the region of the vacuum chamber adjacent to the workpiece stage.

Growing community of inventors

Austin, TX, United States of America

Joel Brad Bailey