Raytheon Company

Sealed Air Corporation

Joel Askinazi

Tom Feng

John J Vajo

George T Bertram

Authi Ariamuthu Narayanan

Semyon Krislav

Hoa T Bui

Alfred W Fielding

Joseph A Vigil

Method for producing novel diamond bodies having near-surface areas of reduced index of refraction which act as an anti-reflection layer. The method comprises displacing some of the ions present in the diamond lattice structure at said areas with preselected ions, such as of C, Si, Fe, Ni, Ti or Au, by ion implantation means to produce desired optical properties, such as for lens coatings. The ion-implanted diamond body preferably is subjected to high temperature post-annealing.

Method for producing low reflectance diamond and products therefor

A method of fabricating an infrared (IR) window (,) which has a high transmittance at IR frequencies includes the steps of providing a protective layer (,) and an IR substrate (,) each having a high IR transmittance. An inner surface (,) of the protective layer (,) and an outer surface (,) of the IR substrate (,) are contacted without adhesive therebetween. The protective layer (,) and the IR substrate (,) are annealed at a bonding temperature. Anti-reflection coatings (,), (,) can be applied to an outer surface (,) of the protective layer (,) and to an inner surface (,) of the IR substrate (,). The IR window (,) can be installed as a shield for an IR sensor mounted on an aircraft. The IR window (,) can be removed from the aircraft and the protective layer (,) and the IR substrate (,) can be debonded by heating the IR window (,) above the bonding temperature. The protective layer (,) and the IR substrate (,) can be separated and a new protective layer (,) can be provided. An inner surface,of the new protective layer (,) and an outer surface (,) of the IR substrate (,) can be contacted at ambient temperature without adhesive therebetween. The new protective layer (,) and the IR substrate (,) can be annealed at a bonding temperature.

Composite infrared windows fabricated by direct bonding

The present invention provides a broadband transmitting protective coating (10) including an AlGaP protective layer (14) deposited on an optical substrate (12) and an anti-reflection film (16) deposited on the AlGaP protective layer (14). The coating (10) is suitable for use with typical infrared and broadband optical substrate materials such as germanium or multi-spectral ZnS. In the case of a germanium substrate (12), the anti-reflection film (16), (16a) preferably consists of a single layer of hard carbon or alternating layers of hard carbon and silicon. In the case of a multi-spectral ZnS substrate (12a), the anti-reflection film (16b) preferably consists of layered Al.sub.2 O.sub.3 /TaO.sub.5 /LaF.sub.3 /MgF.sub.2. The protective coating (10) is preferably deposited on the optical substrate (12) by a metal organic chemical vapor deposition process wherein an initial layer of AlP is nucleated on the substrate (12) at a temperature of approximately 400.degree. C. The temperature of the substrate (12) is then raised to approximately 600.degree. C. and a layer of AlGaP (14) is grown on the substrate (12) to a preselected thickness. The AlGaP coated optical substrate (12) is then polished to a desired smoothness. The anti-reflection film (16) is then deposited on the AlGaP layer (14) using an RF chemical vapor deposition process or a thermal evaporation process.

Broadband protective optical window coating

An electrically conductive infrared (IR) window (10) has high transmittance at IR wavelengths and includes an electrically conductive protective layer (14) which is direct bonded to a substrate (16) at room temperature without adhesive therebetween. The protective layer (14) and substrate (16) are transparent at IR wavelengths. The protective layer (14) and the substrate (16) are annealed at a bonding temperature above room temperature to enhance the bond strength. The protective layer (14) preferably comprises at least one of doped silicon and doped gallium arsenide and has a conductivity between 1 and 500 ohms/square. The substrate (16) preferably comprises at least one of zinc sulfide, zinc selenide, germanium, and gallium arsenide. The protective layer (14) and substrate (16) should be made of different materials with different coefficients of thermal expansion to allow debonding by heating above the bonding temperature.

Electrically conducting, directly bonded infrared windows

A cushion packing material for use in protecting objects from shock and vibrational loads. The cushion packing comprises a dimensionally stable thermoformed shell forming a chamber therein of a predetermined configuration and having a foam material disposed therewithin so as to provide a molded density of less than or equal to 1.5 pounds per cubic foot. Preferably, the foam comprises a low density polyurethane foam. The dimensionally stable shell is thermoformed in a mold and is removed therefrom for filling with the low density foam. The cushion packing provides substantially equivalent or improved cushioning benefits in terms of dissipating dynamic forces at higher static stresses or loadings.

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Trumbull, CT, United States of America

Joel Askinazi