Fujitsu Corporation

Joe Yamaguchi

Koji Watanabe

Masato Wakamura

Kaoru Hashimoto

Kyoichiro Kawano

Tatuo Chiyonobu

Yoshihiro Nakata

Hideki Harada

Yoshiyuki Ohkura

Shyun-ichi Fukuyama

Michiko Katayama

A material and a method for planarizing an uneven surface of a substrate, such as those used for making wiring boards and electronic devices and having broad patterns on their surfaces, are provided. The material is a polysilphenylenesiloxane or a copolymer of polysilphenylenesiloxane with an organosiloxane, and is applied to an uneven surface of a substrate, and then heated to be reflowed to thereby be formed into a planarized film or layer. The material allows a substrate containing wiring having a width of up to several hundred micrometers to be planarized.

Material and method for planarization of substrate

An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Electrical connecting device and method for making same

Growing community of inventors

Kawasaki, Japan

Joe Yamaguchi