Applied Materials, Inc.

Joe Stevens

Yezdi N Dordi

Michael N Sugarman

Donald J Olgado

Mark Robert Denome

Jayant Lakshmikanthan

Roy Edwards

Bob Lowrance

Howard E Grunes

Yeuk-Fai Edwin Mok

Igor G Kogan

Allen Thompson

Muhammad Atif Malik

Ashok K Das

David P Alvarez

Norman Cowan

Henan Hao

Timothy H Franklin

Erich Tzou

Matt Tsai

Alex Ko

An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

Electro-chemical deposition cell for face-up processing of single semiconductor substrates

The present invention provides an apparatus for etching a substrate, comprising: a container; a substrate support disposed in the container; a rotation actuator attached to the substrate support; and a fluid delivery assembly disposed in the container to deliver an etchant to a peripheral portion of a substrate disposed on the substrate support. Preferably, the substrate support comprises a vacuum chuck and the fluid delivery assembly comprises one or more nozzles. The invention also provide a method for etching a substrate, comprising: rotating a substrate positioned on a rotatable substrate support; and delivering an etchant to a peripheral portion of the substrate. Preferably, the substrate is rotated at between about 100 rpm and about 1000 rpm, and the etchant is delivered in a direction that is substantially tangent to the peripheral portion of the substrate at an incident angle between about 0 degrees and about 45 degrees from a surface of substrate.

Edge bead removal/spin rinse dry (EBR/SRD) module

The present invention provides a bladder assembly for use in an electroplating cell. The bladder assembly comprises a mounting plate, a bladder, and an annular manifold. One or more inlets are formed in the mounting plate and are coupled to a fluid source. The manifold is adapted to be received in a recess formed in the lower face of the mounting plate and secures the bladder thereto. Outlets formed in the manifold communicate with the inlets to route a fluid from the fluid source into the bladder to inflate the same. A substrate disposed on a contact ring opposite the bladder is thereby selectively biased toward a seating surface of the contact ring. A pumping system coupled at the backside of the substrate provides a pressure or vacuum condition.

Inflatable compliant bladder assembly

The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers. The substrate support member also rotates and vibrates during processing to enhance the electro-deposition onto the substrate plating surface.

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes an edge bead removal/spin-rinse-dry (EBR/SRD) station disposed on the mainframe adjacent the loading station, a rapid thermal anneal chamber attached to the loading station, a seed layer repair station disposed on the mainframe, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Electro-chemical deposition system

The present invention provides a cathode contact ring for use in an electroplating cell. The contact ring comprises an insulative body having a substrate seating surface and one or more conducting members disposed in the insulative body. The conducting members provide discrete conducting pathways and are defined by inner and outer conducting pads linked by conducting members. A power supply is attached to the conducting members to deliver current and voltage to a substrate during processing. The substrate seating surface comprises an isolation gasket extending diametrically interior to the inner conducting pads such that electrolyte is prevented from depositing on the backside of the substrate. The insulative body provides seating surfaces for other cell components, such as the lid, so that no additional insulating material is needed to isolate the components. A portion of the insulative body is disposed through a plurality of holes formed in the conducting framework. The holes provide increased integration and, consequently, increased strength and durability of the contact ring.

Cathode contact ring for electrochemical deposition

The present invention provides a bladder assembly,for use in an electroplating cell,. The bladder assembly,comprises a mounting plate,, a bladder,, and an annular manifold,. One or more inlets,are formed in the mounting plate,and are coupled to a fluid source,. The manifold,is adapted to be received in a recess,formed in the lower face of the mounting plate,and secures the bladder,thereto. Outlets,formed in the manifold,communicate with the inlets,to route a fluid from the fluid source,into the bladder,to inflate the same. A substrate,disposed on a contact ring,opposite the bladder,is thereby selectively biased toward a seating surface of the contact ring,. A pumping system,coupled at the backside of the substrate,provides a pressure or vacuum condition.

An improved method and apparatus are disclosed for isolating product gas from compressor operating fluid. A portion of a piston rod directly exposed to the compressor's operating fluid (the oily portion of the piston rod) is atmospherically isolated from the remaining portion of the piston rod by providing the piston rod with a collar that separates the oily portion of the piston rod from the remainder of the piston rod. A first and a second flexible membrane are coupled to the collar to form a first isolation region, and a second isolation region; the first isolation region encases the oily portion of the piston rod and atmospherically isolates it from the second isolation region, and the second isolation region provides additional isolation from both the operating fluid and the ambient environment. A higher pressure is maintained along the backside of the piston that compresses the product gas than the pressure within the adjacent isolation region. Pairs of wipers with vents coupled therebetween additionally may be employed to further improve product gas isolation.

Apparatus and method for compressing high purity gas

An improved processing chamber is provided that withstands numerous high pressure/high temperature processing cycles without heater breakage. The processing chamber contains a high conductivity, a high emissivity and/or a high transmissivity shield positioned in sufficient proximity to a heater to prohibit gas currents such as convection current loops from forming between the shield and the heater. The shield is preferably a thin anodized metal or a sapphire sheet.

High pressure/high temperature process chamber

The present invention provides a method and apparatus for protecting the edge of a substrate and securing the substrate to the support member during processing. The present invention preferably provides minimal contact with the substrate and provides improved edge exclusion. Support tabs extend inwardly from the lower roof surface to support the apparatus on the substrate and the inner terminus of the apparatus approaches the edge of the substrate to provide the improved edge exclusion. A variable height lower roof surface is provided over the edge of the substrate to provide an effective increased roof aspect ratio (width of the roof:height of the roof above the substrate) over the edge of the substrate which reduces the likelihood that a bridging layer will form between the apparatus and the substrate or beyond the substrate.

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San Jose, CA, United States of America

Joe Stevens