Motorola Corporation

Continental Automotive Systems Corporation

Joe Pin Wang

Shiuh-Hui Steven Chen

Cheryl B Field

Didier Lefebvre

Yanling Kang

Michael J Pfeifer

Sut-Mui Tang

A micro-electromechanical pressure transducer formed from a silicon die centers itself on a pedestal, formed from either a metal or a dielectric, by applying a predetermined amount of liquid epoxy adhesive to the square, top surface of the pedestal and allowing the liquid adhesive to distribute itself over the top surface. A MEMS die placed atop the liquid adhesive is centered on the top surface by surface tension between sides of the die and the top surface.

Die bond design for medium pressure sensor

Thermally-induced stress on a silicon micro-electromechanical pressure transducer (MEMS sensor) is reduced by attaching the MEMS sensor to a plastic filled with low Cfillers that lowers the plastic's coefficient of thermal expansion (C) to be closer to that of silicon. The MEMS sensor is attached to the housing using an epoxy adhesive/silica filler mixture, which when cured has a Cbetween about ten PPM/&#xb0; C. and about thirty PPM/&#xb0; C. in order to match the housing C. The adhesive also has a glass transition temperature (Tg) above the operating temperature range. This design provides good sealing of the sensor and stable sensor outputs.

Micro-electromechanical pressure sensor having reduced thermally-induced stress

A microdevice assembly () that includes a device microstructure (), a housing (), and a fine grain getter layer (). The housing () has a base portion () and a lid (). The device microstructure () is attached to the base portion () and the lid () is hermetically sealed to the base portion (). The housing () defines a cavity () surrounding the device microstructure (). The fine grain getter layer () is on an interior side () of the lid () for maintaining a vacuum in the cavity () surrounding the device microstructure (). The lid () may be made of metal or have at least a metallic surface in the region where the fine grain getter layer () is applied. The fine grain getter layer () has a sub-micron grain size. There is also a method for making the microdevice assembly ().

Microdevice assembly having a fine grain getter layer for maintaining vacuum

A method of separating a thin die ( ) from a support body ( ) of a semiconductor wafer ( ). The thin die ( ) being initially attached to the support body ( ) by an attachment mechanism ( ). The attachment mechanism may be a plurality of tethers ( ) that extend between the thin die ( ) and the support body ( ). The method may include the steps of: positioning the wafer ( ) on a rigid backing ( ) having a hole ( ), the hole ( ) positioned beneath the thin die ( ); positioning a tip ( ) of a handler ( ) above the thin die ( ), the tip ( ) having a passageway ( ) to a vacuum source; positioning an ejection pin ( ) in a spaced apart relationship beneath the thin die ( ); moving the tip ( ) of the handler ( ) downward toward the thin die ( ) to break the attachment mechanism ( ) and clamp the thin die ( ) between the tip ( ) of the handler ( ) and the ejection pin ( ); and moving the ejection pin ( ) upward in the direction of the tip ( ) of the handler ( ) until the thin die ( ) is extracted from the wafer ( ).

Method of separating and handling a thin semiconductor die on a wafer

A reliable sensor provides a user-friendly semiconductor sensing device and transducer which accurately detects the characteristics of a fluid, such as pressure and strain, at high temperature operating conditions. The high performance sensor is particularly useful for use with diesel engines and internal combustion engines in vehicles. The sensor can comprise a single die with a transverse strain gauge or a group of strain gauges which are located at a position on the die to help minimize electric effects of thermal stress on the gauges during pressure detection and operation of the vehicle. The die can be glass fused, such as by glass frit, to a diaphragm, such as a stainless steel diaphragm, so as not to readily corrode in the fluid.

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Long Grove, IL, United States of America

Joe Pin Wang