Seagate Technology Incorporated

Western Digital Technologies, Inc.

Sandisk Technologies Inc.

Joe Paul Moolanmoozha

Shailesh R Nayak

Manish Sharma

Steven S Cheng

Nicholas Maris

Erik Silaprasay

Alexander Carl Worrall

Rajesh Maruti Bhagwat

Nitin Satishchandra Kabra

Shailendra Singh Chauhan

Nilesh Govande

Yalaj Goyal

Arjun Jayaprakash Guzar

Systems and methods are described for assembling multiple circuit boards using support elements to provide a stacked circuit board assembly. A support element is mounted to a first (e.g., main) circuit board, and a pair of additional circuit boards (e.g., daughter boards) are mounted to the support element on two opposite sides of the first circuit board to provide a stacked circuit board assembly.

Multiple circuit board assembly including a support element and method of manufacture thereof

An integrated circuit (IC) device test socket has an integrally formed IC picking mechanism for removing an IC device from the test socket after testing. The test socket has a base member and a cover member. The base member includes a recess that is configured to receive an IC device for testing. The cover member is configured to removably engage the base member to secure the IC device between the cover member and the base member. The cover member includes an IC picking mechanism configured to use suction to retain the IC device to the cover member.

Integrated circuit test socket with integrated device picking mechanism

A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Crossflow air deflector for high density independent airflow control

A hybrid storage device includes a first storage medium configured to store data at a first speed and a second storage medium configured to store data at a second speed. The first storage medium may be a NAND flash storage medium, and the second storage medium may be disc storage medium. Partitions of the first storage medium are associated with partitions of the second storage medium to form at least two storage tiers. Each of the storage tiers may include different NAND partition capacities. The storage device further includes a peer to peer communication channel between the first storage medium and the second storage medium for moving data between a NAND partition and HDD partition. The storage device is accessible via a dual port SAS or PCIe interface.

Hybrid storage device partitions with storage tiers

Based on a command to interrupt operation of a selected one or more of a plurality of data storage drives coupled to two or more storage controllers, two or more signals are sent from the two or more storage controllers via two or more data busses associated with and coupled to the respective two or more controllers. The selected data storage drive receives the two or more signals via the two or more data busses. Based on determining that the two or more signals agree, the operation of the selected drive is interrupted.

Logic circuit that provides verification of signals used to interrupt server operation

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Bengaluru, India

Joe Paul Moolanmoozha