Texas Instruments Corporation

Joe Adam Garcia

Mahmud Halim Chowdhury

Abram M Castro

Usman Mahmood Chaudhry

Anindya Poddar

John Paul Tellkamp

Honglin Guo

Amin Ahmad Sijelmassi

Murali Kittappa

An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).

QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same

In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.

Packages with electrical fuses

An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).

Growing community of inventors

Royse City, TX, United States of America

Joe Adam Garcia