Agilent Technologies, Inc.

Jochen Zaiser

Marcus Mueller

The present invention refers to an electronic apparatus, preferably a microchip testing device, comprising at least one circuit board mounted on a cooling device. This circuit board supports at least one microchip. The circuit board supports the microchip on a side turned to the cooling device, wherein the cooling device is adapted for providing a cooling of a side of the microchip, which side is turned to the cooling device. A thermal conductor is arranged between the microchip and the cooling device for providing a thermal contact between the cooling device and the one side of the microchip turned to the cooling device. The thermal conductor comprises at least one of a group comprising: a thermally conductive knead, a plasticine, a kneadable and thermally conductive material, and a plastically deformable and thermally conductive material.

Cooling a microchip on a circuit board

An interface provides an electrical contact between test equipment and application equipment. The interface receives plural individual structures. At least one of the structures comprises at least one electrical path that provides the electrical contact. At least one of the structures is electrically isolated with respect to the interface and/or other structures and has a ground condition substantially independent of the ground condition of the interface and/or other structures.

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Holzgerlingen, Germany

Jochen Zaiser