Tdk-micronas Gmbh

Jochen Stephan

Marc Baumann

Thilo Rubehn

Christian Joos

A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.

Sensor component with cap over trench and sensor elements

A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.

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Freiburg, Germany

Jochen Stephan