Robert Boschgmbh

Akustica, Inc.

Robe It Bosch Gmbh

Jochen Reinmuth

Johannes Classen

Jens Frey

Heribert Weber

Frank Reichenbach

Achim Breitling

Julian Gonska

Yvonne Bergmann

Julia Amthor

Hans Artmann

Peter Schmollngruber

Arnd Kaelberer

Mawuli Ametowobla

Martin Rambach

Heiko Stahl

Philip Kappe

Mirko Hattass

Eckhard Graf

Matthew Lewis

Timo Schary

Amin Jemili

Neil A Davies

Ralf Boessendoerfer

Ando Feyh

Thomas Friedrich

Helmut Grutzeck

Simon Armbruster

Axel Franke

Lars Tebje

Arnim Hoechst

Robert Maul

Andreas Scheurle

Holger Hoefer

Hartmut Kueppers

Stefan Majoni

Alexander Ilin

Markus Kuhnke

Jan-Peter Stadler

Kathrin Gutsche

Christoph Schelling

Hubert Benzel

Gary O'Brien

Burkhard Kuhlmann

Rolf Scheben

Ralf Reichenbach

Christina Leinenbach

Odd-Axel Pruetz

Bernhard Gehl

Vijaye Rajaraman

Stefan Weiss

Christoph Hermes

Michael Knauss

Matthias Kuehnel

Guenther-Nino-Carlo Ullrich

Sebastian Guenther

Harald Emmerich

Andreas Lassl

Brett Mathew Diamond

Georg Bischopink

Daniel Meisel

Andrea Urban

Daniel Haug

Marcus Ahles

Daniel Monteiro Diniz Reis

Timo Lindemann

Sebastian Schuler-Watkins

Barbara Will

Antoine Puygranier

Christian Bierhoff

Christian Rettig

Michael Baumann

Michael Saettler

Peter Sudy

Jan Waldmann

Monika Koster

Till Schade

Dusan Radovic

Holger Rumpf

Matthias Neubauer

Martin Lindemann

Eduard Rije

Pia Bustian-Todorov

Luise Fuchs

Steffen Becker

Kurt-Ulrich Ritzau

Stefan Thomas Jaeger

A micromechanical component for a sound transducer device. The component includes a diaphragm element which includes a first diaphragm surface and a second diaphragm surface which points away from the first diaphragm surface, and at least one piezoelectric element situated on and/or at the first diaphragm surface. The micromechanical component includes a substrate having at least one control and/or evaluation circuit developed thereon and/or therein, the first diaphragm surface pointing toward the substrate, and the substrate is attached to the diaphragm element at least via at least one an electrically conductive bond connection structure which is developed on and/or at the first diaphragm surface, from which the second diaphragm surface is pointing away, and the at least one piezoelectric element is electrically connected to the at least one control and/or evaluation circuit at least via the at least one electrically conductive bond connection structure.

Micromechanical component for a sound transducer and corresponding production method

A micromechanical sensor structure. The micromechanical sensor structure including: a substrate; a mass which can be elastically deflected relative to the substrate; a measuring unit for detecting a deflection of the mass; and a damping structure for damping a deflection of the mass. The damping structure includes first and second damping combs which mesh together. The first damping comb is arranged on the mass and the second damping comb is arranged movably on a deflecting structure. When the mass is deflected in a first direction, the second damping comb is moved via the deflecting structure relative to the substrate in a second direction opposite the first direction.

Micromechanical sensor structure with damping structure

A sensor system. The sensory system includes a substrate extending in a substrate plane, a closed cavity and a movable structure in the closed cavity, at least one portion of the movable structure being situated at a distance opposite a surface of the substrate extending in parallel to the main extension plane within the cavity, the distance varying when the movable structure is deflected, a temperature difference between the surface of the substrate and the movable structure being measurable by an action of force on the movable structure.

Sensor device for measuring a temperature difference in a computer chip system

A micromechanical component for a sensor device, including a seismic mass, which is situated at and/or in a mounting and which includes a first electrode area, a second electrode area electrically insulated from the first electrode area, and a connecting area made up of at least one electrically insulating material. The first electrode area and the second electrode area each mechanically contact the connecting area and are connected to one another via the connecting area. At least one first conductive area of the first electrode area and a second conductive area of the second electrode area are structured out of a first semiconductor and/or metal layer. The first electrode area also includes a third conductive area. The second electrode area also includes a fourth conductive area. The third conductive area and the fourth conductive area are structured out of a second semiconductor and/or metal layer.

Micromechanical component for a sensor device

A MEMS relay. The MEMS relay includes: a movable switching element, on which a second switching surface is arranged in a first end section; a substrate having a first switching surface arranged thereon, which is designed to interact with the second switching surface; a switching electrode, to which an electrical switching voltage may be applied, the movable switching element being able to bring the second switching surface into contact with the first switching surface by way of an electrostatic force generated by the electrical switching voltage; at least one second compensation surface arranged in an end section of the movable switching element opposite the second switching surface; and a first compensation surface, which is designed to interact with the second compensation surface and is galvanically connected to the first switching surface via a cable.

MEMS relay

A MEMS switch that includes a substrate with a first insulating layer and a silicon layer thereabove, a fixed portion and a movable switching portion being formed in the silicon layer. A first metal layer is situated in recesses in the silicon layer at a side of the silicon layer facing away from the substrate, the first metal layer forming at least one switchable electrical contact between the fixed portion and the switching portion. A method for manufacturing a MEMS switch including at least one embedded metal contact is also described.

Method for manufacturing a MEMS switch having an embedded metal contact

A micromechanical component for a pressure and inertial sensor device. The component includes a substrate having an upper substrate surface; a diaphragm having an inner diaphragm side oriented towards the upper substrate surface and an outer diaphragm side pointing away from the upper substrate surface, the inner diaphragm side bordering on an inner volume, in which a reference pressure is enclosed, and the diaphragm being able to be warped using a pressure difference between a pressure prevailing on its outer diaphragm side and the reference pressure; and a seismic mass situated in the inner volume, a sensor electrode, which projects out on the inner diaphragm side and extends into the inner volume, being displaceable with respect to the substrate due to a warping of the diaphragm. A pressure and inertial sensor device, and a method of manufacturing a micromechanical component for a pressure and inertial sensor device, are also described.

Micromechanical component for a pressure and inertial sensor device

A device for detecting sound in the surroundings of an automobile, including a first structure-borne noise sensor, which is acoustically coupled to a first oscillating body at an outside of the automobile and provides a first audio signal, including a second audio signal, which represents sound from an interior of the automobile, and including a processing unit, which is configured to subtract at least the second audio signal from the first audio signal.

Device for detecting sound in the surroundings of an automobile

A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.

Micromechanical sensor device and corresponding production method

A MEMS switch having a substrate, a micromechanical function layer situated above the substrate, and a fixed part and an electrically operable, deflectable switch element are developed in the micromechanical function layer, the switch element for closing an electrically conductive contact with the fixed part being suspended on at least one first spring in a deflectable manner. In a first operating state, the switch element is in a first position at a first distance from the fixed part, and the electrical contact is open. In a second operating state, the switch element is in a second position at a second distance from the fixed part, and the first spring is deflected and exerts a first restoring force, and the switch element establishes an operative connection with at least one second spring and the electrical contact is open. In a third operating state, the switch element is in a third position.

Capacitively operable MEMS switch

A method for manufacturing a microelectromechanical structure. The method includes: forming a first and a second functional layer including recesses, a third functional layer, and three insulating layers situated therebetween, a structured lateral area of the third functional layer defining a movable structure, the insulating layers and the first and second functional layers each including a lateral area situated beneath the structured lateral area of the third functional layer and corresponding to a perpendicular projection of the structured lateral area; etching the insulating layers to remove the lateral area of the third insulating layer, and expose the movable structure, all recesses of the first functional layer situated in the lateral area of the first functional layer being formed by narrow trenches, the first functional layer being formed to include an electrically insulated segment in the lateral area which is separated from the remainder of the first functional layer by trenches.

Method for manufacturing a microelectromechanical structure and microelectromechanical structure

A method for manufacturing a polysilicon SOI substrate including a cavity. The method includes: providing a silicon substrate including a sacrificial layer thereon; producing a first polysilicon layer on the sacrificial layer; depositing a structuring layer on the first polysilicon layer; introducing trenches through the structuring layer, the first polysilicon layer, and the sacrificial layer up to the silicon substrate; producing a cavity in the silicon substrate by etching, an etching medium being conducted thereto through the trenches; producing a second polysilicon layer on the first polysilicon layer, the trenches being thereby closed. A micromechanical device is also described.

Method for manufacturing a polysilicon SOI substrate including a cavity

A micromechanical component for a capacitive sensor or switch device, having a substrate having a substrate surface, a diaphragm mounted on the substrate surface having a self-supporting region, at least one lever element and at least one first electrode connected to the at least one lever element. The at least one lever element is connected to the diaphragm in such a way that when there is a warping of the self-supporting region of the diaphragm the at least one lever element is set into a rotational movement, whereby the at least one connected first electrode is set into a first adjustment movement oriented at an angle to the substrate surface. The at least one lever element and the at least one first electrode connected to the at least one lever element are situated between the substrate surface and the diaphragm inner side of the self-supporting region of the diaphragm.

Micromechanical component for a capacitive sensor or switch device

A micromechanical component for a pressure sensor device. The component includes a substrate; a frame structure, mounted on a boundary surface of the substrate, including a diaphragm, whose inner diaphragm side borders on an interior volume, framed by the frame structure, so that when a pressure prevailing on its outer diaphragm side is above a reference pressure, the diaphragm is warped into the interior volume; and a rocker structure suspended on the inner diaphragm side, which in its operating mode is set into a rocker motion. An open gap exists between a stop face of the rocker structure and the boundary surface when a pressure prevailing on the outer diaphragm side is above the reference pressure and below a minimum operating pressure. The open gap is closed only when a pressure prevailing on the outer diaphragm side becomes greater or equal to the minimum operating pressure.

Micromechanical component for a pressure sensor device

A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.

Micromechanical component and method for manufacturing a micromechanical component

Growing community of inventors

Reutlingen, Germany

Jochen Reinmuth