Hymite A/s

Epcos Pte Ltd

Microtronic A/s

Sonion Mems A/s

Pulse Mems Aps.

Jochen Friedrich Kuhmann

Matthias Mullenborn

Peter Ulrik Scheel

Matthias Heschel

Mogens Rysholt Poulsen

The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Surface mountable transducer system

An optical structure includes a substrate for receiving an optical device. The substrate may hold waveguide reference surfaces for vertical alignment of the device to a waveguide core of the substrate. A carrier for holding the optical device has contact surface parts for holding the optical device and for mounting the carrier to an optical device receiving substrate.

Optical device receiving substrate and optical device holding carrier

The present invention relates to an assembly structure and a method for assembling active and passive photonic and/or optoelectronic devices on a silicon board. The invention relates in particular to an assembly structure and a method for aligning the photonic devices during the assembling procedure. According to the present invention, the assembly structure comprises one or more alignment features comprising tapered side surface parts in directions at least substantially parallel to an optical axis. By providing a tapering in a direction in a direction at least substantially parallel to the first optical axis, any inaccuracies primarily affects the non-critical positioning in the direction along the optical axis, whereas the critical positioning transverse to the optical axis merely depends on the symmetry of alignment features. The errors from the inherent inaccuracy of the position and shape of alignment features are thereby minimized. Also, the devices to be aligned are preferably arranged on top of the alignment features which forms part of the basic structure on the silicon board. All alignment features can thereby be defined in a single mask step together with the structures with which the alignment is to be carried out, resulting in an improved accuracy of the assembly structure. The resulting components will be used especially for broadband telecommunication components.

Hybrid integration of active and passive optical components on an Si-board

The present invention relates solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.

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Copenhagen, Denmark

Jochen Friedrich Kuhmann