E.i. Dupont De Nemours and Company

Joao Carlos Malerbi

Deepukumar M Nair

James M Parisi

Kumaran M Nair

Michael Arnett Smith

Elizabeth D Hughes

Mark Frederick McCombs

Scott E Gordon

Ken E Souders

Bradley Thrasher

Disclosed are methods and devices of microwave/millimeter wave package application.

Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications

Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 &#x3bc;m. Also disclosed is a process for making the LTCC structure.

Low temperature co-fired ceramic structure for high frequency applications and process for making same

The invention relates to methods of forming high frequency receivers, transmitters and transceivers from Low Temperature Co-fired Ceramic (LTCC) materials. Two or more layers of a low k thick film dielectric tape and in contact with each other and two or more layers of a low k thick film dielectric tape and in contact with each other form a low k high k LTCC structure with improved properties and the ability to support economical mass production techniques for high frequency transceivers. The invention also relates to the LTCC receiving, transmitting and transceiving structures and the devices made from such structures.

Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom

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Westfield, IN, United States of America

Joao Carlos Malerbi