Bae Systems Electronics Limited

Joanne Hurley

Nicholas Martin Shorrocks

Matthew Dale Holme

Andrew Duncan Parsons

A thermal imaging device comprises an array of microbridges( ) disposed on a silicon readout circuit substrate ( ). Each microbridge ( ) is supported above the substrate ( ) by electrodes ( and ) so that a cavity ( ) is present between the microbridge ( ) and the substrate ( ). Each microbridge ( ) has a collecting area, a region of which is occupied by a ferroelectric active element ( ) which converts to received thermal radiation into an electrical response. Radiation which is received by regions of the collecting area not occupied by the active element ( ) is converted into heat energy and then transmitted to the active element ( ) by conduction.

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Northampton, United Kingdom

Joanne Hurley