Hewlett-packard Development Company, L.p.

Joan Mach

Pau Martin Vidal

Marius Valles

Rafel Texido

Gerard Mosquera

Albert Iglesias Millan

In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

3D build platform refill opening and cap

In one example, an article for distributing powder includes a plate having holes therein through which a powder may pass from a first side of the plate to a second side of the plate opposite the first side and multiple ramps each intersecting the plate at one or multiple holes and sloping away from the first side of the plate in a first direction at an angle less than 90&#xb0;.

Growing community of inventors

Sant Cugat del Valles, Spain

Joan Mach