Basf Aktiengesellschaft

Dsm N.v.

Reichhold As

Basf Se Corporation

Joachim Zwecker

Michael Henningsen

Anton Hesse

Rainer Klopsch

Miran Yu

Lionel Gehringer

Monika Charrak

Dieter Buhl

Achim Kaffee

Heinz Fuerst

Harald Schneider

Chunhong Yin

Jan Visser

Holger Schreiner

The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one imidazole compound and at least one latent hardener. In said epoxy-resin composition, the amount of the imidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition, and the total amount of primary amine groups optionally comprised does not exceed a proportion of 0.09 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm. The fiber-matrix-semifinished-product composition can be produced via mixing of the constituents, whereupon the composition thickens. The resultant thickened product (semisolid fiber-matrix semifinished product) features comparatively short maturing time and comparatively long available operating time. The invention also relates to the corresponding semisolid fiber-matrix composite, in particular to the semisolid SMC and to the corresponding cured fiber-matrix semifinished product, in particular the cured SMC. Finally, the invention also relates to a screening process for identifying epoxy-resin-based compositions which are suitable for use as thermoset matrix for producing SMC.

Epoxy-resin composition for fiber-matrix semifinished products

The invention relates to a process for preparing a conductive curable moulding compound with reduced electrical surface resistance, comprising mixing together an unsaturated polyester resin, a thermoplastic polymer, a conductive paste and optionally a filler, and is characterized in that the conductive paste is obtained by dispersing conductive pigment particles in a solution of a thermoplastic polymer in a suitable solvent. The invention further relates to the conductive paste itself and to mouldings having reduced surface resistance, obtained therefrom.

Method for the apparatus of conductive curable polyester moulding

Moldings having improved surface properties are produced using BMC molding materials which contain crystalline unsaturated polyesters.

Molding ofBMC molding materials having improved surface properties

Stable, low-evaporation unsaturated polyester resins contain an ethylenically unsaturated polyester, styrene as comonomer, paraffins for preventing styrene evaporation and a pyrogenic silica with both hydrophilic and hydrophobic end groups.

Low-evaporation polyester resins

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Weinheim, Germany

Joachim Zwecker