Ledvance Gmbh

Osram Ag

Osram Opto Semiconductor Gmbh

Joachim Wirth-Schoen

Reinhold Schmidt

Andreas Engel

Angela Eberhardt

Ewald Poesl

A tube for a semiconductor tubular lamp is disclosed, which tube has at least one holding projection for holding at least one printed circuit board on the inside of the tube, wherein the tube is a glass tube, and the at least one holding projection is an inwardly bulging, reshaped burling region of the tube. A semiconductor tubular lamp has a tube and at least one printed circuit board fitted with a semiconductor light source, which is accommodated in the tube and is held transversely to a longitudinal direction of the tube by means of at least one burling region in a form-fitted manner. The invention is in particular applicable to LED retrofit lamps for fluorescent lamps, in particular for replacing conventional tube lamps or flashlights of type T5 or T8.

Semiconductor tubular lamp, tube therefor, and production method

The invention relates to a tube () for a semiconductor tubular lamp (), which tube has at least one holding projection for holding at least one printed circuit board () on the inside of the tube, wherein the tube () is a glass tube, and the at least one holding projection is an inwardly bulging, reshaped burling region (-) of the tube (). A semiconductor tubular lamp () has a tube () and at least one printed circuit board () fitted with a semiconductor light source (), which is accommodated in the tube () and is held transversely to a longitudinal direction (L) of the tube () by means of at least one burling region (-) in a form-fitted manner. A method serves to produce a tube (), wherein the tube () is provided, locally heated, and pressed inwardly at the at least one locally heated point for generating the at least one burling area (-). The invention is in particular applicable to LED retrofit lamps for fluorescent lamps, in particular for replacing conventional tube lamps or flashlights of type T5 or T8.

Semiconductor-tubular lamp, tube therefor, and production method

A radiation-emitting component includes a semiconductor chip and a conversion element. The semiconductor chip includes an active layer suitable for generating electromagnetic radiation and a radiation exit face. The conversion element includes a matrix material and a luminescent material. The conversion element is arranged downstream of the radiation exit face of the semiconductor chip. The matrix material comprises at least 40 wt. % tellurium oxide and is free of boron trioxide and/or germanium oxide. A method for producing such a radiation-emitting component is furthermore stated.

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Guenzburg, Germany

Joachim Wirth-Schoen