W.c. Heraeus Gmbh

Joachim Schmidt

Christina Modes

Frieder Gora

Hans-Georg Burckhardt

Sybille Kemmler-Sack

Jurgen Dehoust

Albrecht Bischoff

Holger Eisentraut

Karlheinz Guldner

Rainer Kiemel

Karl-Heinz Guldner

Inge Blanke

Resistor composition to produce thick film resistors, preferably the resistor films in sensors for temperature measurement, includes glass frit and an oxide which is at least one of CaCu.sub.3 Ru.sub.4 O.sub.12 and LaCu.sub.3 Ru.sub.4 O.sub.12.

Resistor composition and its use

Electrically conductive oxides of the pyrochlore family based on copper and/or silver, lead, bismuth, and ruthenium, characterized by the formula M.sub.x M'.sub.y (Pb,Bi).sub.2-x-y Ru.sub.2 O.sub.7-z, wherein M=copper and/or silver, M'=calcium, strontium, and/or barium, 0.ltoreq.x.ltoreq.0.6, 0.1.ltoreq.y.ltoreq.1.0, and 0.1.ltoreq.z.ltoreq.1.0.

Oxides of the pyrochlore family and electrically resistant materials

To prevent defoliation or splitting-off of an aluminum or aluminum alloy which is roll-plated on a copper or copper alloy base, an intermediate nickel layer having less than 0.05% contaminants is applied beneath the aluminum layer. If the base is a copper alloy, an intermediate copper layer which is of an oxygen-free copper or copper alloy is placed between the base and the nickel layer. Typical dimensions are: base copper layer (1, 13): 0.25 mm; oxygen-free copper layer (7, 15): 0.005 to 0.01 mm; nickel layer with less than 0.05% contaminants or impurities: about 0.01 mm; AlSi 0.5 aluminum alloy: 0.005 to 0.006 mm.

Multi-layer electrical support substrate

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Hanau, Germany

Joachim Schmidt