E+e Elektronik Ges.m.b.h.

Joachim Runck

Elmar Josef Mayer

Georg Niessner

Markus Humer

Clemens Simbrunner

A moisture sensor arrangement including a plate-like semiconductor substrate and an integrated signal processing component disposed on a first side of the semiconductor substrate. The moisture sensor arrangement including a capacitive moisture sensor connected electrically conductively to the integrated signal processing component, wherein the capacitive moisture sensor is disposed on either the first side or a second side of the semiconductor substrate that is opposite the first side of the semiconductor substrate. In addition, the plate-like semiconductor substrate includes 1) plated through-holes, by way of which elements on the first side and the second side of the semiconductor substrate are electrically connectable to one another; and 2) a temperature sensor integrated with the integrated signal processing component.

Growing community of inventors

Linz, Austria

Joachim Runck