Wacker Chemie Ag

Siltronic Ag

Joachim Mattes

Matthias Vietz

Anton Huber

Peter Gruebl

Bruno Lichtenegger

Martin Brixel

Joerg Moser

Siegfried Riess

Peter Wimmer

Peter Grübl

Reduction of contamination and the proportion of fines fractions in the packaging of rod form polysilicon is achieved by directly filling a plastic bag with polysilicon from a cleaning bowl by a rotating motion which causes polysilicon chunks to slide into the bag.

Packaging for polysilicon and method for packaging polysilicon

A method for packing polycrystalline silicon in the form of fragments or round rods, wherein at least one film in each case is inserted into a cuboidal cardboard box matched to the dimensions of the polycrystalline silicon to be packed, the polycrystalline silicon is introduced into the at least one film, the at least one film of thickness 10 to 1000 &#x3bc;m subsequently being welded and enclosing the polycrystalline silicon, and this at least one film being surrounded by a further film having a reinforcing structure or by a shaping element.

Packing of polycrystalline silicon

An apparatus is disclosed for comminuting a polycrystalline silicon rod, which apparatus includes a base, at least one movable comminuting tool and optionally at least one immovable anvil. A silicon rod to be comminuted lies on a longitudinal axis oriented parallel or virtually parallel to the surface of the base and can be adjusted between the comminuting tool and anvil. Also disclosed is a method for comminuting a polycrystalline silicon rod.

Apparatus and method for comminuting a polycrystalline silicon rod

Semiconductor wafers with profiled edges, are produced with decreased losses due to edge or other damage by separating a semiconductor wafer from a crystal; profiling the edge in a profile producing step wherein the edge is mechanically machined to a profile that is true to scale with respect to a predefined target profile; mechanically machining the wafer to reduce the a thickness of the semiconductor wafer; and machining the edge profile to acquire the target profile.

Method for producing a semiconductor wafer with profiled edge

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Burghausen, Germany

Joachim Mattes