Intel Corporation

Joachim Assenmacher

Georg Seidemann

Walther Lutz

Martin Ostermayr

Peter Baumgartner

A semiconductor die is disclosed, including a plurality of transistors at a frontside of a semiconductor substrate, a backside inductor at a backside of the semiconductor substrate; and a frontside inductor at the frontside of the semiconductor substrate. The frontside inductor and the backside inductor are inductively coupled.

Semiconductor dies and devices with frontside and backside coils for inductive coupling

A semiconductor die is disclosed, including circuitry comprising a transistor at a frontside of a semiconductor substrate, and a backside inductor at a backside of the semiconductor substrate. The backside inductor is electrically connected to the transistor of the circuitry.

Growing community of inventors

Unterhaching, Germany

Joachim Assenmacher