Sandisk Technologies Inc.

Western Digital Technologies, Inc.

Jo Sato

Tatsuya Hinoue

Michiaki Sano

Masanori Tsutsumi

Yuji Takahashi

Kota Funayama

Wei Kuo Shih

Hisaya Sakai

A lower source-level dielectric etch-stop layer, a source-level sacrificial layer, and an upper source-level dielectric etch-stop layer are formed over a substrate. An alternating stack of insulating layers and sacrificial material layers is formed thereabove. Memory stack structures are formed through the alternating stack. Backside openings are formed through the alternating stack and into the in-process source-level material layers such that tapered surfaces are formed through the upper source-level dielectric etch-stop layer. A source cavity is formed by removing the source-level sacrificial layer, and a continuous source contact layer is formed in the source cavity and in peripheral portions of the backside openings. Portions of the continuous source contact layer overlying the tapered surfaces are removed by performing an isotropic etch process. Remaining portions of the continuous source contact layer comprise a source contact layer. The sacrificial material layers are replaced with electrically conductive layers.

Spacerless source contact layer replacement process and three-dimensional memory device formed by the process

An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. Memory stack structures extending through the alternating stack are formed. A backside trench is formed through the alternating stack. The sacrificial material layers are replaced with electrically conductive layers. An insulating spacer and the backside contact via structure are formed within the backside trench. A dielectric isolation trench is formed by removing a peripheral portion of an upper region of the backside contact via structure and an upper portion of the insulating spacer. A dielectric isolation spacer is formed in the dielectric isolation trench to prevent an electrical short between an upper portion of the backside contact via structure and the electrically conductive layers.

Three-dimensional memory device with a dielectric isolation spacer and methods of forming the same

First elongated loop-shaped conductive material portions are formed over a substrate. A two-dimensional array of memory pillar structures is formed over the first elongated loop-shaped conductive material portions. Second elongated loop-shaped conductive material portions over the two-dimensional array of memory pillar structures. Each of the elongated loop-shaped conductive material potions includes a respective pair of line segments and a respective pair of end segments adjoined to ends of the respective pair of line segments. A moat trench that at least partially laterally encloses the two-dimensional array of memory pillar structures can be formed by performing an anisotropic etch process that removes parts of the first and second elongated loop-shaped conductive material portions, thereby separating each loop-shaped conductive material portion into two disjoined line segments.

Multi-level loop cut process for a three-dimensional memory device using pitch-doubled metal lines

A gas scrubber includes a canister having a rotatable spiral separator which provides a non-linear path configured to be filled with modular adsorbent material portions between a gas inlet and a gas outlet.

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Yokkaichi, Japan

Jo Sato