Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Jo Kawamura

Hisao Furukawa

Fumio Kawakubo

Mikiko Suzuki

Hiroshi Iwakiri

Toshiro Nanbu

Yasushi Kato

Naotami Ando

Shoichi Matsumura

Hirotoshi Kawaguchi

Hideyuki Ohnari

Keiko Hasegawa

Toan Harimoto

Coating composition

A method applying a curable sealant composition comprising an oxyalkylene polymer having at least one silicon-containing group to the silicon atom of which a hydroxy group and/or a hydrolyzable group are bonded onto previously applied and cured sealant composition comprising an oxyalkylene polymer having at least one silicon-containing group to the silicon atom of which a hydroxy group and/or a hydrolyzable group are bonded, which method comprises applying a primer comprising a copolymer having at least one silicon-containing group to the silicon atom of which a hydroxy group and/or a hydrolyzable group are bonded,said copolymer having a molecular chain comprising substatially

Application method for sealant

A curable resin composition comprising (a) an oxyalkylene polymer comprising at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a curing catalyst for the oxyalkylene polymer containing at least one reactive silicon group per molecule, (c) an epoxy resin, and (d) a ketimine; and a curable resin composition further comprises (e) a reactive silicon group-containing silane compound in addition to (a) to (d).

Curable resin composition

A curable resin composition is disclosed which is composed of (a) an oxyalkylene polymer containing at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a copolymer having a molecular chain which comprises (A) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 1 to 8 carbon atoms in the alkyl moiety thereof and (B) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 10 or more carbon atoms wherein the total number of monomer units (A) and monomer units (B) constitutes more than 50% of the monomer units in the copolymer (b), and (c) a curing catalyst.

Curable composition

A thermosetting composition (A) a hydroxyl group-containing resin, (B) an alkoxysilane group-containing copolymer and (C) a curing catalyst. The film of the composition is excellent in not only adhesion, gel percentage and surface hardness but also solvent resistance, acid resistance, and stain resistance.

Thermosetting composition

A curable composition containing (a) 100 parts by weight of an oxyalkylene polymer having a silicon atom-containing group to which a hydroxyl group or a hydrolyzable group is bonded and capable of crosslinking on formation of a siloxane bond and (b) from 0.01 to 20 parts by weight of a hydrolyzable silicon compound represented by formula (1): ##STR1## wherein X represents a hydrolyzable group; R.sup.1 represents a monovalent hydrocarbon group; R.sup.2 represents a monovalent organic group containing an amino group or an imino group and having a carbon atom number to nitrogen atom number ratio (C/N ratio) of more than 3; m represents 0, 1 or 2; n represents 1, 2 or 3; and (m+n) is less than 4.

A resin composition comprising 5 to 100% by weight of a vinyl copolymer comprising 0.1 to 99% by weight of units having the formula (I): ##STR1## The composition of the invention is excellent in weatherability.

Resin composition

A curable composition at room temperature comprising (A) 100 parts by weight of a hydrolyzable silyl group-containing vinyl polymer, (B) 0.1 to 100 parts by weight of a specific silane compound and (C) 0 to 20 parts by weight of a curing catalyst, the silane compound (B) being a silane compound selected from ##STR1## The composition is excellent in not only adhesion to melamine alkyd or malamine acrylic resin coatings but also hardness, solvent resistance and staining resistance.

Curable composition at room temperature

A curable copolymer having a number average molecular weight of 1,000 to 100,000, and having the formula (1): ##STR1## and a process for the preparation of the curable copolymer (1). The curable copolymer of the present invention has excellent flexibility, solvent resistance and adhesion to organic materials.

Curable copolymer and process for preparation thereof

A process for the preparation of a room-temperature curable resin comprises reacting a compound (A) containing at least two acryloyl groups and/or methacryloyl groups in a molecule, and having from 100 to 100,000 of number-average molecular weight, with an aminosilane compound (B) represented by formula, ##STR1## (wherein X is a hydrolyzable group selected from the group consisting of halogen, alkoxy, acryloxy, ketoxymate, amino, acid amide, aminoxy, mercapto, alkenyloxy groups; R.sub.1 is C.sub.1 -C.sub.10 alkyl group, aryl group, or aralkyl group; n is an integer of from 1 to 3, and m is an integer of from 1 to 10), at the ratio of at least 0.2 equivalents of primary amino groups contained in the compound (B) to equivalent of acryloyl groups and/or methacryloyl groups contained in the compound (A), under substantially water-free condition, subsequently reacting the reaction product of aminosilane-modified resin and, furtherwith a monofunctional isocyanate compound (C) represented by formula,

Growing community of inventors

Akashi, Japan

Jo Kawamura