Texas Instruments Corporation

Georgia Tech Research Corporation

Jo Bito

Benjamin Stassen Cook

Dok Won Lee

Keith Ryan Green

Steven Alfred Kummerl

Baher S Haroun

Srinath Mathur Ramaswamy

William David French

Simon Joshua Jacobs

Ricky A Jackson

Daniel Lee Revier

Arup Polley

Emmanouil Tentzeris

Rongwei Zhang

James Huckabee

Dishit Paresh Parekh

Yong Deng

An integrated filter optical package including an ambient light sensor that incorporates an infrared (IR) filter in an integrated circuit (IC) stacked-die configuration is provided. The integrated filter optical package incorporates an infrared (IR) coated glass layer to filter out or block IR light while allowing visible (ambient) light to pass through to a light sensitive die having a light sensor. The ambient light sensor detects an amount of visible light that passes through the IR coated glass layer and adjusts a brightness or intensity of a display screen on an electronic device accordingly so that the display screen is readable.

Integrated filter optical package

In examples, a sensor package comprises a die pad and a semiconductor die on the die pad. The semiconductor die has an active surface. The sensor package includes a light sensor on the active surface of the semiconductor die. The sensor package includes a mold compound covering the die pad, the semiconductor die, and a portion of the active surface. The sensor package includes a light filter covering the light sensor and abutting the mold compound. The light filter includes a combination of silicone, metal particles, and an organic dye. The combination is configured to reject light having a wavelength in a target wavelength range. The light filter has a thickness of at least 0.5 millimeters.

Sensor packages with wavelength-specific light filters

A packaged semiconductor device includes an IC die having bump features that are coupled to bond pads flip chip attached to a custom LF. The custom LF includes metal structures including metal leads on at least 2 sides, and printed metal providing a printed LF portion including printed metal traces that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads configured for receiving the bump features including at least some of the printed metal traces coupled to the bond pads on the IC die. The IC die is flip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.

Custom leadframe from standard plus printed leadframe portion

In one example, circuitry is formed in a semiconductor die. A magnetic concentrator is formed on a surface of the semiconductor die and over the circuitry. An isolation spacer is placed on a lead frame. The semiconductor die is placed on the isolation spacer, and the magnetic concentrator is aligned to overlap the lead frame. Electrical interconnects are formed between the semiconductor die and the lead frame.

Integrated current sensor with magnetic flux concentrators

In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.

Shielded sensor structure and method of making same

A packaged current sensor includes a lead frame, an integrated circuit, an isolation spacer, a first magnetic concentrator, and a second magnetic concentrator. The lead frame includes a conductor. The isolation spacer is between the lead frame and the integrated circuit. The first magnetic concentrator is aligned with the conductor. The second magnetic concentrator is aligned with the conductor.

A Hall sensor circuit includes a first Hall sensor, a second Hall sensor, a first preamplifier circuit, a second preamplifier circuit, a subtractor circuit, and a duty cycling circuit. The first preamplifier circuit includes an input and an output. The input is coupled to the first Hall sensor. The second preamplifier circuit includes a first input, a second input, and an output. The first input is coupled to the second Hall sensor. The subtractor circuit includes a first input coupled to the output of the first preamplifier circuit, a second input coupled to the output of the second preamplifier circuit, and an output coupled to the second input of the second preamplifier circuit. The duty cycling circuit is coupled to the second preamplifier circuit and the second Hall sensor.

Hall sensor circuit

A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.

Magnetic flux concentrator for in-plane direction magnetic field concentration

A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.

Semiconductor package with liquid metal conductors

A system including: a photovoltaic (PV) cell; a radio frequency (RF) rectifier; a DC-DC converter connected to an output of the RF rectifier; and a control circuit configured to control an operation of the DC-DC converter, and configured to receive operating power from the PV cell.

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Dallas, TX, United States of America

Jo Bito