Samsung Electronics Co., Ltd.

Yonsei University

Skhynix Inc.

Korea University Research and Business Foundation

Lifetree Biotech Co., Ltd.

Wonjinmetal Co., Ltd.

Lg Display Co., Ltd.

Jiyoung Kim

Yoosang Hwang

Dongsoo Woo

Woosung Yang

Bong-Soo Kim

Jiwon Kim

Junsoo Kim

Kiseok Lee

Dongjin Lee

Hyun-Woo Chung

Hyeongsun Hong

Jiwoo Lee

Hui-Jung Kim

Satoru Yamada

Sung-Min Hwang

Joon-Sung Lim

Jintaek Park

Daeik Kim

Seong Soon Cho

Kang-Uk Kim

Jaehoon Lee

Joonhee Lee

Moonyoung Jeong

Sukkang Sung

Jihye Kim

Jaehyun Park

Dohyung Kim

Daewon Kim

Junyoung Choi

Jongmin Baek

Minho Kim

Dongjun Lee

Jemin Park

Yong Kwan Kim

Sungho Jang

Jinho Kim

Hoon Moo Choi

Sungho Park

Seung Ho Lee

Hyungjin Kim

Dong Jin Lee

Tae Hoon Lee

Dongsuk Shin

Sanghoon Ahn

Buseop Jung

Hanseok Kim

Kyu-Hee Han

Naein Lee

Joonsung Lim

Byunghee Kim

Taeshick Kim

Pilwon Seo

Yoonjo Hwang

Seongook Jung

Taehyun An

Yongchul Oh

Jungwoo Song

Bongtae Park

Seokhan Park

Hyeonju Lee

Namho Jeon

Kwangmin Kim

Hyungeun Choi

Hunkook Lee

Kwangtae Hwang

Jungtae Sung

Seuk Son

Sangyeon Han

Byongmo Moon

Moorym Choi

Jungchul Lee

ChangWook Han

Heedong Choi

Kyupil Lee

Hakseung Han

Joongchan Shin

Jonggeun Yoon

Nakjin Son

Kyung-Eun Kim

Jay-Bok Choi

Kyuhee Han

Seunguk Han

Deokyoung Jung

Gwijeong Cho

Byungjin Lee

Hyoungsub Kim

Boram Namgoong

Minhwan Seo

Bomi Lee

Bumkyu Kang

Sungmin Ahn

Mingyu Lee

Hokyun An

Hobin Song

Junghyung Kim

Jongsoo Lee

Sejie Takaki

Jin-Seong Lee

Wondon Joo

Kooknoh Yoon

An electronic device is provided, which can include a flexible display, a rolling actuator for expanding or reducing the flexible display, a wireless communication circuit, and a processor. The processor can receive, via the wireless communication circuit, a message from an external device, and in response to receiving the message, drive the first rolling actuator, expand the flexible display by a first length in a first direction, and display a first UI including a plurality of content, in a first region of the flexible display expanded by the first length.

Method for controlling flexible display and electronic device thereof

A three-dimensional semiconductor memory device may include a peripheral structure and a cell structure on the peripheral structure. The cell structure may include a substrate having first and second surfaces, which are opposite to each other, a stack including gate electrodes, which are stacked on the first surface of the substrate, an insulating layer on the second surface of the substrate, a penetration contact plug penetrating the first surface of the substrate, a first gapfill conductive pattern provided to penetrate the second surface of the substrate and the insulating layer and spaced apart from the penetration contact plug, a second gapfill conductive pattern provided to penetrate the second surface of the substrate and the insulating layer and connected to the penetration contact plug, a first gapfill spacer between the first gapfill conductive pattern and the substrate, and a second gapfill spacer between the second gapfill conductive pattern and the substrate.

Three-dimensional semiconductor memory device and electronic system including the same

This electronic device may comprise: a flexible display; a first rolling actuator configured to extend the flexible display in a first direction; a second rolling actuator configured to extend the flexible display in a second direction opposite to the first direction; and at least one processor. The at least one processor may be configured to: determine the mounting state of the electronic device; acquire information about the position of a peripheral device, which is linked with the electronic device, based on the mounting state satisfying a designated condition; set the extension direction of the flexible display on the basis of the information about the position of the peripheral device; and control the first rolling actuator and/or the second rolling actuator to extend the flexible display in the first direction and/or the second direction on the basis of the set extension direction.

Method for controlling flexible display, and electronic device

A semiconductor device includes a first substrate structure including a first decoder circuit region, a second decoder circuit region, and a page buffer circuit region, and a second substrate structure connected to the first substrate structure. The second substrate structure includes a first cell structure that includes first horizontally extending gate electrodes, and a second cell structure that includes second horizontally extending gate electrodes. The second cell structure is disposed below the first cell structure. A first stair structure is disposed to one side of the first and second cell structures, and a second stair structure is disposed to a second side opposite the first side. a dummy structure is disposed below the first stair structure. First contact plugs pass through the first stair structure and the first dummy structure and are respectively connected to the first gate electrodes, and second contact plugs pass through the second stair structure and are respectively connected to the second gate electrodes.

Semiconductor device and data storage system including semiconductor device

An optical apparatus includes a folding mirror configured to direct first and second illumination lights on first and second alignment marks respectively and reflect first and second reflected lights reflected from the first and second alignment marks in different horizontal directions respectively, first and second lenses arranged respectively in optical paths of the first and second reflected lights reflected from the first and second reflective surfaces of the folding mirror, first and second reflection portions configured to reflect the first and second reflected lights passing through the first and second lenses respectively, and a beam splitter prism configured to divide an illumination light incident through a first surface into the first and second illumination lights and direct to the first and second reflection portions, and transmit the first and second reflected lights reflected by the first and second reflection portions through a second surface.

Optical assembly for alignment inspection, optical apparatus including the same, die bonding system and die bonding method using the same

A semiconductor device includes a first substrate structure including a substrate, circuit devices, and first bonding metal layers on the circuit devices, and a second substrate structure connected to the first substrate structure on the first substrate structure, wherein the second substrate structure includes a plate layer having a first region and a second region, gate electrodes stacked below the plate layer and extending by different lengths in a second direction in the second region, channel structures penetrating the gate electrodes and each including a channel layer, in the first region, input/output contact structures penetrating the plate layer and the gate electrodes and each including a contact conductive layer, in the second region, and second bonding metal layers connected to the first bonding metal layers, wherein a level of upper surfaces of the input/output contact structures is higher than a level of upper surfaces of the channel structures.

Semiconductor devices and data storage systems including the same

An error handling device includes a cross-voltage sense amplifier and an error handling circuit. The cross-voltage sense amplifier is configured to perform a normal sense operation and a cross sense operation. The normal sense operation generates normal sense data by providing an input voltage and a comparison voltage to first and second inputs of a comparator, respectively. The cross sense operation generates cross sense data by providing the input voltage and the comparison voltage to the second and first inputs of the comparator, respectively. The error handling circuit identifies a location of an error using the normal sense data and the cross sense data and corrects the error.

Error handling device, semiconductor memory device including the same, and error handling method including cross sensing operation

An apparatus and method of measuring pattern uniformity, and a method of manufacturing a mask by using the measurement method are provided. The measurement apparatus includes a light source configured to generate and output light, a stage configured to support a measurement target, an optical system configured to transfer the light, output from the light source, to the measurement target supported on the stage, and a first detector configured to detect light reflected and diffracted by the measurement target, or diffracted by passing through the measurement target, wherein the first detector is configured to detect a pupil image of a pupil plane and to measure pattern uniformity of an array area of the measurement target on the basis of intensity of at least one of zero-order light and 1-order light of the pupil image.

Apparatus and method of measuring uniformity based on pupil image and method of manufacturing mask by using the method

A semiconductor device includes a substrate having a cell region and a connection region, a first stack structure with a plurality of first gate layers and a plurality of first interlayer insulating layers, and a second stack structure with a plurality of second gate layers and a plurality of second interlayer insulating layers. Each of the first gate layers includes a central portion in the cell region of the substrate and an end portion in the connection region of the substrate. Each of the second gate layers includes a central portion in the cell region of the substrate and an end portion in the connection region of the substrate. A thickness difference between the end and central portions of each first gate layer is different from a thickness difference between the end and central portions of each second gate layer.

Semiconductor device and electronic system including the same

A semiconductor device includes a first substrate structure including a first substrate, circuit devices, first interconnection lines, bonding metal layers on upper surfaces of the first interconnection lines, and a first bonding insulating layer on the upper surfaces of the first interconnection lines and on lateral surfaces of the bonding metal layers, and a second substrate structure on the first substrate structure, and including a second substrate, gate electrodes, channel structures, second interconnection lines, bonding vias connected to the second interconnection lines and the bonding metal layers and having a lateral surface that is inclined such that widths of the bonding vias increase approaching the first substrate structure, and a second bonding insulating layer in contact with at least lower portions of the bonding vias. The bonding metal layers include dummy bonding metal layers not connected to the bonding vias and that contacts the second bonding insulating layer.

Semiconductor device and data storage system including the same

A semiconductor device includes a substrate including a cell region and a connection region. The connection region includes a plurality of pad regions and a through electrode region. A horizontal conductive layer is on the substrate. A supporter is on the horizontal conductive layer. The supporter includes a first portion in the cell region, a second portion in the plurality of pad regions, and a third portion in the through electrode region. A connection conductive layer is between the first portion and the horizontal conductive layer. A connection mold layer is between the third portion and the horizontal conductive layer. A first buried insulation layer passing through the third portion, the connection mold layer, and the horizontal conductive layer is provided. A stacked structure is on the substrate. A through electrode passing through the first buried insulation layer is provided.

Semiconductor devices including supporter

A three-dimensional semiconductor memory device may include a first substrate including a cell array region and a cell array contact region, a peripheral circuit structure on the first substrate, and a cell array structure. The cell array structure may include a stack on the peripheral circuit structure, first vertical channel structures and second vertical channel structures on the cell array region and penetrating the stack, and a second substrate connected to the first vertical channel structures and second vertical channel structures. The stack may be between the peripheral circuit structure and the second substrate. The second substrate may include a first portion and a second portion. The first portion may contact the first vertical channel structures and may be doped a first conductivity type. The second portion may contact the second vertical channel structures and may be doped a second conductivity type different from the first conductivity type.

At least one processor included in an electronic device can acquire first motion data about the motion of the electronic device through at least one motion sensor, acquire second motion data about a motion of an external device through a connector included in the electronic device, determine, on the basis of the first motion data and the second motion data, the folding angle between the electronic device and the external device connected to the electronic device, and determine, on the basis of the determined folding angle, an input mode that sets whether to display a user interface on a display or whether to block an input signal received through the connector. Various other embodiments identified through the specification are possible.

Electronic device for controlling input mode according to folding angle, and method therefor

A semiconductor device includes: a data sampler configured to receive a data signal having a first frequency and to sample the data signal with a clock signal having a second frequency, higher than the first frequency, to output data for a time corresponding to a unit interval of the data signal; an error sampler configured to sample the data signal with an error clock signal having the second frequency and a phase, different from a phase of the clock signal, to output a plurality of pieces of error data for the time corresponding to the unit interval; and an eye-opening monitor (EOM) circuit configured to compare the data with each of the plurality of pieces of error data to obtain an eye diagram of the data signal in the unit interval.

Semiconductor device

Growing community of inventors

Yongin-si, South Korea

Jiyoung Kim