Samsung Electronics Co., Ltd.

Jiyeon Han

Taeyoung Kim

Jiyun Seol

Chanhong Kim

Hyunjung Kim

Jaeyoel Kim

Inhak Na

Chansik Kwon

Jinduck Park

Junyoung Ko

Youngho Kim

Yongseong Kim

Dan Nah

Jongkeun Moon

Yuyoul Eom

Deunghyeon Jeong

Inwook Im

A semiconductor chip includes a semiconductor substrate including a device region, and an edge region surrounding the device region, a device layer on the semiconductor substrate, a wiring layer on the device layer, a side surface of the wiring layer at least partially defining a recessed region that is in the edge region such that the side surface of the wiring layer is exposed by the recessed region, and an upper insulating layer on the wiring layer. The recessed region extends from a side surface of the device layer toward the device region. A first portion of the upper insulating layer covers the side surface of the wiring layer that is exposed by the recessed region.

Semiconductor chips having recessed regions

A test apparatus includes a test chamber in which a plurality of the semiconductor packages having a plurality of component dies is secured, an operation tester configured to conduct an operation test to the plurality of semiconductor packages to detect whether at least one semiconductor package is an operation fault package having a fault and identify a fault package point at which the operation fault package is located, a fault heat detector configured to detect a fault heat generated from the fault, and a test controller configured to control the operation tester to conduct the operation test to the plurality of semiconductor packages and control the fault heat detector subsequent to the operation test to detect the fault heat generated from the fault of the operation fault package to determine a vertical point of the fault and to determine a fault die having the fault.

Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the same

A method for a transmitter of a mobile communication system transmitting and receiving signals according to an embodiment of the present specification comprises the steps of: transmitting to a receiver system information for transmitting a signal to the receiver including a connection between a wireless resource and a transmitting antenna; transmitting a reference signal to the receiver based on the system information; and receiving from the receiver feedback information generated based on the reference signal. According to an embodiment of the present specification, in a beamforming transmission method of a mobile communication system, a transmitter can determine whether to perform digital pre-coding without advance information from a receiver and can consequently perform a transmission, and can thereby perform lower-overhead and efficient signal transmission/reception.

Hybrid beam forming-based open-loop MIMO transmission method and apparatus therefor

Hybrid beamforming-based open-loop MIMO transmission method and apparatus therefor

Intelligent docking station

Growing community of inventors

Gyeonggi-do, South Korea

Jiyeon Han