3m Innovative Properties Company

Jiwoong Kong

Jung Ju Suh

Seong-Woo Woo

Charles L Bruzzone

Jinbae Kim

A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.

Multilayer tape including plurality of magnetic metal particles and electronic assembly including the same

According to an embodiment of the present invention, an electronic assembly comprises: a circuit board including a plurality of connection parts having electrical conductivity; a plurality of spaced apart semiconductor integrated circuits mounted on the circuit board and electrically connected to the plurality of connection parts; a protective layer disposed on the plurality of semiconductor integrated circuits, substantially surrounding the semiconductor integrated circuits, and having a flat upper surface; and a heat spreading copper layer disposed on the protective layer, having an average thickness greater than or equal to about 3 microns, and an average grain size greater than about 0.15 micron, wherein the heat spreading copper layer may occupy substantially the same space in a length and a width as the circuit board (coextensive), and the average thickness of the protective layer may be equal to or greater than the height of the plurality of spaced apart semiconductor integrated circuits.

Electric assembly including heat spreading layer

An electronic assembly includes a circuit board including a plurality of electrically conductive traces, a cover layer disposed on the circuit board, and a plurality of antenna assemblies disposed on a major top surface of the cover layer and exposing the major top surface therebetween. Each of the antenna assemblies includes an antenna and an adhesive layer bonding the antenna to the major top surface of the cover layer. The antenna is electrically coupled to a corresponding different trace in the plurality of traces. The adhesive layers in the antenna assemblies have substantially a same first composition and a same average first thickness. The antennas in the antenna assemblies have substantially a same second composition and a same average second thickness greater than about 5 microns. The electronic assembly can be singulated to provide antenna assemblies. Methods of making the assemblies are also described.

Antenna assemblies

An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

Growing community of inventors

Gyeonggi-do, South Korea

Jiwoong Kong