Stats Chippac Pte. Ltd.

Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Industry-University Cooperation Foundation Hanyang University

Kookmin University

Yonsei University

Lg Magna E-powertrain Co., Ltd.

Jiwon Lee

ChangOh Kim

YuJeong Jang

JinHee Jung

SungWon Cho

Kyowang Koo

BongWoo Choi

KyoungHee Park

OMin Kwon

Won Woo Ro

Jihye Kim

HunTeak Lee

HeeSoo Lee

Hyunok Oh

Aram Kim

KyungHwan Kim

Jaehyun An

Dongkyu Lee

Seongil O

Jingyeong Kim

Jinhee Jung

Jeonghoon Choi

Gun Ko

Hongju Kal

William Jinho Song

Hyunwuk Lee

Ipoom Jeong

Jinkyoo Lee

Jinsu Oh

Hyoseong Choi

A memory management unit includes a TLB configured to cache PTEs including a mapping between a virtual and a physical frame number, and to convert a virtual address into a physical address using the cached PTEs. A page table walk request queue is configured to queue page requests corresponding to a virtual page number when a TLB miss is occurred, and one or more PTWs are configured to acquire a PTE from the main memory, and to convert the virtual page numbers into physical frame numbers using the PTE. A PTW is configured to select associated page table walk requests having the same base address of corresponding virtual page numbers, to consecutively provide cache line requests for acquiring PTEs corresponding to the associated page table walk requests, to acquire the PTEs corresponding to the associated PTE requests, and to provide the acquired PTEs to the TLB.

Memory management unit and method of walking page table

A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the substrate within the slot. A shielding layer is formed over the encapsulant and physically contacting the surface of the substrate within the slot. The substrate is singulated to form a semiconductor package with the first electrical component after forming the shielding layer.

Semiconductor device and method of forming selective EMI shielding with slotted substrate

A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

Shielded semiconductor package with open terminal and methods of making

A semiconductor device has a substrate and electrical components disposed over the substrate. An encapsulant is disposed over the substrate and electrical components. A multi-layer shielding structure is formed over the encapsulant. The multi-layer shielding structure has a first layer of ferromagnetic material and second layer of a protective layer or conductive layer. The ferromagnetic material can be iron, nickel, nickel iron alloy, iron silicon alloy, silicon steel, nickel iron molybdenum alloy, nickel iron molybdenum copper alloy, iron silicon aluminum alloy, nickel zinc, manganese zinc, other ferrites, amorphous magnetic alloy, amorphous metal alloy, or nanocrystalline alloy. The first layer can be a single, homogeneous material. The protective layer can be stainless steel, tantalum, molybdenum, titanium, nickel, or chromium. The conductive layer can be copper, silver, gold, or aluminum. The multi-layer shielding structure protects the electrical components from low frequency and high frequency interference.

Semiconductor device and method of forming multi-layer shielding structure with layers of ferromagnetic material, protective material, laminate material or conductive material over the semiconductor device

Disclosed is a method of operating a swap memory device configured to communicate with a host device and a main memory device. The method includes receiving, from the host device, a request corresponding to target data, determining, by the swap memory device, a first address of the target data and a second address of a target data block that includes the target data, based on the request, providing, by the swap memory device, the target data to the host device based on the first address, and providing, by the swap memory device, the target data block to the main memory device based on the second address.

Swap memory device providing data and data block, method of operating the same, and method of operating electronic device including the same

A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

Selective EMI shielding using preformed mask with fang design

A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

Semiconductor device and method of forming a slot in EMI shielding with improved removal depth

A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

Semiconductor device with partial EMI shielding removal using laser ablation

An electric motor includes a rotor including a rotary shaft defining a first fluid channel configured to carry a cooling fluid, a rotor core including a plurality of permanent magnets and defining a second fluid channel in communication with the first fluid channel, and end rings mounted on opposite end portions of the rotor core. Each end ring includes injection holes in fluid communication with the second fluid channel and configured to inject the cooling fluid. Each end ring includes a plurality of rotary pins that are circumferentially arranged on an outer surface of the end ring, that are spaced apart from one another, and that are configured to circulate the cooling fluid injected through the plurality of injection holes into the first fluid channel.

Rotor with cooling end rings and electric motor including same

A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

Selective EMI shielding using preformed mask

A controller is provided. The controller creates a page table including page table entries including mapping information for translating a virtual address to a physical address. Each of the page table entries includes: a virtual page number, a physical frame number, valid information, and size information. The virtual page number is included in a virtual address, the physical frame number is included in a physical address, the valid information includes a first predetermined number of bits, and the size information includes a second predetermined number of bits. The first predetermined number of bits represents an address translation range in a page table entry or a number of page table entries to be grouped, and the size information represents a size indicated by each bit of the first predetermined number of bits.

Controller, computing system including the same, and method of creating and searching page table entry for the same

A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

Mask design for improved attach position

Growing community of inventors

Seoul, South Korea

Jiwon Lee