Taiwan Semiconductor Manufacturing Comp. Ltd.

Jiun-Lin Yeh

Hsien-Wei Chen

Shin-Puu Jeng

Yi-Lung Cheng

The present disclosure provides a method and system for heat dissipation in semiconductor devices. In one example, an integrated circuit semiconductor device includes a semiconductor substrate; one or more metallurgy layers connected to the semiconductor substrate, and each of the one or more metallurgy layers includes: one or more conductive lines; and one or more dummy structures between the one or more conductive lines and at least two of the one or more dummy structures are connected; and one or more dielectric layers between the one or more metallurgy layers.

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Taipei, Taiwan

Jiun-Lin Yeh