Lg Innotek Co., Ltd.

Jiun Kong

Il Hwan Seo

Sangwoo Lee

Hongboem Jin

Dongwook Park

A light system including a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer, and a light emitting device package mounted on the conduction layer. Further, the base layer includes iron (Fe).

Light emitting device array and light system

The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.

Light emitting device package and lighting system

Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).

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Seoul, South Korea

Jiun Kong