Cadence Design Systems, Inc.

Jitin Jacob

Taranjit Singh Kukal

Surender Singh

Navkamal Rakra

Embodiments included herein are directed towards a system and method for implementing an IC package design with an IC package design estimator. Embodiments may include estimating a number of layers for an integrated circuit (IC) package design that includes a plurality of IC die designs. Embodiments may further include determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs. Embodiments may also include identifying a number of layers required to perform routing between each of the plurality of IC die designs. Embodiments may further include determining a power layer or ground layer based upon, at least in part, one or more factors and generating an output for the IC package design based upon, at least in part, the estimated number of layers and the power layer or ground layer.

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New Delhi, India

Jitin Jacob