Honeywell International Inc.

Jithesh M Radhakrishnan

Raja Narayanasamy

Donald C Sillanpaa

Dathathreya Durgadhahall Ganesh

Veeragandham Bhanumurthy

A sensor apparatus includes a sensor assembly for maintaining multiple and varying sensor components, wherein the sensor assembly comprises a molded sensor head configured to include a first cavity and a second cavity. A first sensor of a first sensor type can be located and maintained within the first cavity. A second sensor of a second sensor type is generally located and maintained within the second cavity, wherein the first sensor type is different from the second sensor type. The first sensor and the second sensor are respectively packaged into the separate first and second cavities within the molded sensor head of the sensor assembly to provide a sensor apparatus that provides for multiple and varying sensor capabilities.

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Kerala, India

Jithesh M Radhakrishnan