Intel Corporation

Jitendra Kumar Jha

Anand S Murthy

Gilbert W Dewey

Glenn A Glass

Nazila Haratipour

Dan S Lavric

Jack T Kavalieros

Tahir Ghani

Matthew V Metz

Siddharth Chouksey

Srijit Mukherjee

Suresh Vishwanath

Mengcheng Lu

Thomas T Troeger

John F Richards

Oleg Golonzka

Harold W Kennel

Scott Bruce Clendenning

Mohit K Haran

Dax M Crum

Arnab Sen Gupta

Ryan Keech

Orb Acton

Chi-hing Choi

Koustav Ganguly

David J Towner

Omair Saadat

Eric Charles Mattson

Debaleena Nandi

Adedapo A Oni

YenTing Chiu

Source and drain contacts that provide improved contact resistance and contact interface stability for transistors employing silicon and germanium source and drain materials, related transistor structures, integrated circuits, systems, and methods of fabrication are disclosed. Such source and drain contacts include a contact layer of co-deposited titanium and silicon on the silicon and germanium source and drain. The disclosed source and drain contacts improve transistor performance including switching speed and reliability.

Co-deposition of titanium and silicon for improved silicon germanium source and drain contacts

Approaches for fabricating an integrated circuit structure including a titanium silicide material, and the resulting structures, are described. In an example, an integrated circuit structure includes a semiconductor fin above a substrate, a gate electrode over the top and adjacent to the sidewalls of a portion of the semiconductor fin. A titanium silicide material is in direct contact with each of first and second epitaxial semiconductor source or drain structures at first and second sides of the gate electrode. The titanium silicide material is conformal with and hermetically sealing a non-flat topography of each of the first and second epitaxial semiconductor source or drain structures. The titanium silicide material has a total atomic composition including 95% or greater stoichiometric TiSi.

Integrated circuit structures including a titanium silicide material

An integrated circuit structure comprises a first and second vertical arrangement of horizontal nanowires in a PMOS region and in an NMOS region. A first gate stack having a P-type conductive layer surrounds the first vertical arrangement of horizontal nanowires. A second gate stack surrounds the second vertical arrangement of horizontal nanowires. In one embodiment, the second gate stack has an N-type conductive layer, the P-type conductive layer is over the second gate stack, and an N-type conductive fill is between N-type conductive layer and the P-type conductive layer to provide same polarity metal filled gates. In another embodiment, the second gate stack has an N-type conductive layer comprising Titanium (Ti) and 'Nitrogen (N) having a low saturation thickness of 3-3.5 nm surrounding the nanowires, and the N-type conductive layer is covered by the P-type conductive layer.

Gate-all-around integrated circuit structures having uniform threshold voltages and tight gate endcap tolerances

Low resistance approaches for fabricating contacts, and semiconductor structures having low resistance metal contacts, are described. In an example, an integrated circuit structure includes a semiconductor structure above a substrate. A gate electrode is over the semiconductor structure, the gate electrode defining a channel region in the semiconductor structure. A first semiconductor source or drain structure is at a first end of the channel region at a first side of the gate electrode. A second semiconductor source or drain structure is at a second end of the channel region at a second side of the gate electrode, the second end opposite the first end. A source or drain contact is directly on the first or second semiconductor source or drain structure, the source or drain contact including a barrier layer and an inner conductive structure.

Low resistance approaches for fabricating contacts and the resulting structures

Embodiments disclosed herein include semiconductor devices with source/drain interconnects that include a barrier layer. In an embodiment the semiconductor device comprises a source region and a drain region. In an embodiment, a semiconductor channel is between the source region and the drain region, and a gate electrode is over the semiconductor channel. In an embodiment, the semiconductor device further comprises interconnects to the source region and the drain region. In an embodiment, the interconnects comprise a barrier layer, a metal layer, and a fill metal.

Halogen treatment for NMOS contact resistance improvement

Growing community of inventors

Hillsboro, OR, United States of America

Jitendra Kumar Jha