Sugon Dataenergy(beijing) Co., Ltd

Jisheng He

Chen Wang

Lei Zhang

Hongjie Wu

Xintao Cui

Lei Han

Shuai Zhang

Jiawei Liu

Zhihong Zhao

Bingshuang Li

Yingjun Wu

Xing Li

Zhen Sun

Jingnan Peng

The present invention relates to a method for enhancing boiling performance of chip surface comprising steps of mounting a heat pipe directly above the surface of the chip, and forming a porous structure for increasing the vaporization core on an upper surface of the heat pipe. Performing an enhancing treatment in boiling of the upper surface of the heat pipe by mounting the heat pipe directly above the chip makes a temperature field of the boiling surface uniform, increases the boiling area and vaporization core, strengthens the boiling heat transfer, and reduces the core temperature of the chip.

Method for enhancing boiling performance of chip surface

The present invention relates to an immersed heat dissipation device for power battery, comprising a battery heat dissipation module, a battery unit, a liquid refrigerant, a main inlet pipe and a main outlet pipe, wherein the battery heat dissipation module is a structure of sealed box that contains the liquid refrigerant, and a plurality of the battery heat dissipation modules are connected to each other and arranged in the heat dissipation device for power battery. The battery can be effectively cooled and the temperature of the battery can be effectively controlled, and ensure a uniform temperature for the battery unit, thereby improving the performance and life of the power battery of new energy vehicle.

Immersed heat dissipation device for power battery

The application relates to a high-efficiency phase-change condenser for a supercomputer, including a condenser box body, a refrigerant input pipe, a refrigerant output pipe and a condensing coil; a liquid refrigerant accommodated in the condenser box body, and a gas-phase region existing between a liquid level of the liquid refrigerant and a top of the condenser box body; one portion of the condensing coil immersed into the liquid refrigerant, and the other portion of the condensing coil located in the gas-phase region above the liquid level of the liquid refrigerant; and in the gas-phase region, refrigerant vapor bubbles are liquified by the condensing coil. Liquid-phase and gas-phase saturated refrigerants can be completely condensed by the condensing coil in a limited condenser space, thereby improving heat exchange efficiency of the condenser.

High-efficiency phase-change condenser of a supercomputer

Growing community of inventors

Beijing, China

Jisheng He