Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Engineering Company, Limited

Jiro Takamura

Kunio Kobayashi

Hiromichi Yamada

Shinji Semba

Kiyoji Imanaka

Mitsuru Yamazaki

Shinji Sogabe

Hiroyuki Shinmen

Kunihiro Shigetomo

Sekio Ito

Eiri Yuhara

A transporting apparatus used in testing a plurality of semiconductor devices includes a magazine in which a plurality of pallets are stacked in plural stages, each pallet with a plurality of semiconductor device placed thereon; a distributing stocker mechanism for placing the plurality of pallets in the magazine onto a carrier; a carrier transporting mechanism for transporting the carrier into a test station in a constant temperature room and transporting the carrier after to outside the constant temperature room; and a recovery stocker mechanism for recovering the plurality of pallets after test on the carrier into the magazine. Thus, the transporting apparatus with high installing area efficiency and high test efficiency can be fabricated at low production cost.

Transporting apparatus for semiconductor device

A method of manufacturing semiconductor devices includes accommodating the semiconductor devices in the form of semimanufactures in accomodating tools having uniform outer dimensions regardless of the type of the semiconductor devices; receiving the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices while maintaining the semiconductor devices in the accomodating tools; and processing the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices.

Process of raising a semiconductor device out of a pallet using a

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Hyogo, Japan

Jiro Takamura