Sumitomo Electric Industries, Limited

Jiro Shinkai

Toshio Takagi

Hiroyuki Yabe

Takashi Kato

Kenichi Sawada

So Tanaka

Atsushi Miki

Hirotaka Oomori

Goro Sasaki

Yoko Watanabe

Kazuhiro Tanida

A semiconductor module includes: a circuit board; a semiconductor chip having a first electrode pad on a first surface, bonded to the circuit board at a second surface that is opposite to the first surface, and having side surfaces intersecting the first surface and the second surface; an external terminal electrically connected to the first electrode pad; and an insulating member configured to fix the external terminal, wherein by the insulating member contacting the side surfaces of the semiconductor chip at a plurality of locations, parallel movement and rotational movement of the semiconductor chip relative to the insulating member in a plane parallel, to the first surface are restricted, and wherein the external terminal penetrates the insulating member.

Semiconductor module

A semiconductor module includes a semiconductor chip having a first surface provided with a first electrode pad and a second surface, opposite to the first surface, provided with a second electrode pad, a first substrate connected to the first electrode pad, a second substrate provided on the side of the second surface, and a conductor section, electrically connecting the second electrode pad and the second substrate, and having a size greater than the second electrode pad in a plan view viewed from the side of the second substrate.

Semiconductor device

A semiconductor module according to one embodiment includes a semiconductor chip, a wiring substrate, a mounting plate provided with the wiring substrate thereon, a frame body defining a case for the wiring substrate, together with the mounting plate, a bus bar extending from the case and being inserted into a side wall of the frame. The side wall has a projection. The bus bar includes a first region in the side wall, a second region extending from a first end of the first region outward from the frame, a third region extending from a second end of the first region into the frame. The third region is bent based on the shape being close to the wiring substrate of the projection. The mounting plate with the wiring substrate is attached to the frame such that the third region is in press-contact with the wiring pattern.

Semiconductor module and method for manufacturing the same

A semiconductor device in accordance with an embodiment comprises a semiconductor chip; a die pad having a chip mount surface for mounting the semiconductor chip; first leads electrically connected to the semiconductor chip; a thermosetting resin part for securing end parts of the first leads to the die pad; and a thermoplastic resin part for sealing the semiconductor chip, the die pad, and the thermosetting resin part.

Semiconductor device and method of manufacturing same

Semiconductor module for power conversion

The object of the present invention is to provide an optical module for the WDM communication system, in which the oscillation wavelength is on the grid of the WDM regulation, moreover the optical output power and the oscillation wavelength can be controlled independently. The present module comprises a semiconductor light-emitting device, a wedge shaped etalon device and two light-receiving devices. The etalon device contains a first portion, on which the anti-reflection films are coated, and a second portion. One of the receiving devices detects light transmitted through the first portion of the etalon device, while the other device detects light through the second portion. Signal from the former device controls the output power of the light-emitting device, while the signal from the latter receiving device controls the oscillation wavelength of the laser.

Optical module

The light-emitting module includes a semiconductor light-emitting device, a first optical detector for monitoring the magnitude of light emitted from the semiconductor device, a second optical detector for monitoring an oscillation wavelength of the semiconductor device, and an Etalon. The first detector is located in a position where the wavelength variation of the transmitted light from the Etalon is relatively small, while the second detector is located in a position where the wavelength variation of the transmitted light is relatively large. The geometrical size of the second detector along the first direction is wider than that along the second direction normal to the first direction; this thus enhances the efficiency of wavelength sensitivity.

The object of the present invention is to provide an optical module for a WDM communication system, in which the oscillation wavelength is on the grid of the WDM regulation. The optical output power and the oscillation wavelength can be controlled independently. The present module includes a semiconductor light-emitting device, a wedge shaped etalon device and two light-receiving devices. The etalon contains a second portion, on which anti-reflection films are coated, and a first portion. One of the receiving devices detects light transmitted through the second portion of the etalon, while the other device detects light through the first portion. A signal from the former device controls the output power of the light-emitting device, while a signal from the latter receiving device controls the oscillation wavelength of the laser.

A main portion of an optical module includes a thermoelectric cooler and a chip carrier placed on the cooler A semiconductor light-emitting device a lens photodetectors , and an etalon are directly or indirectly mounted on the chip carrier . Supporting members and are also fixed on the chip carrier . A roof is supported by the supporting members and positioned above the etalon The roof supporting members and chip carrier are maintained at substantially equal temperatures by the cooler As a result, the temperature of the etalon is stabilized, and therefore the variation in the lock wavelength is suppressed.

Growing community of inventors

Osaka, Japan

Jiro Shinkai