Mitsumi Electric Company Ltd.

Hitachi, Ltd.

Jiro Nakano

Sadahiro Ohyama

Noriaki Sekine

Hideji Matsuura

Noribumi Ishi

Masao Yano

Junichi Shimizu

Toshio Takeuchi

Seiichi Onoda

Yasumasa Koakutsu

Yasumi Ushikubo

Tetsuya Takahashi

Yasusi Anzo

Masahiro Hirano

Masatoshi Watanabe

A circuit board includes an insulative ceramic substrate, electrode portions and wiring portions formed on the ceramic substrate by selectively removing portions of a conductor layer plated on said ceramic substrate, a resistor layer formed on the ceramic substrate and connected to the electrode portions, and a pair of connecting thick film conductors for electrically connecting the thick film resistor and the conductor layer on both ends of the thick film resistor. The resistor layer includes a thick film resistor which is formed on the ceramic substrate. The conductor layer and the thick film resistor each have an end portion which is formed directly on the same connecting thick film conductor.

Circuit board and method of producing circuit board

A connector comprises a plug and a socket. The plug has a main plug body, a plurality of contact pins projecting from the main plug body and including a contact pin for grounding, and a shielding member surrounding the plurality of contact pins. The socket has a main socket body, a plug receiving part provided on the main socket body for receiving the shielding member, a plurality of contact portions provided within the plug receiving part for making contact with corresponding ones of the plurality of contact pins and including a first contact portion for making contact with the contact pin for grounding, and a second contact portion provided on the main socket body for making contact with the shielding member. The plug is detachably coupled to the socket by inserting the shielding member into the plug receiving part. The first and second contact portions are made of a single contact member.

Connector comprising a plug having a built-in optoelectronic conversion

An optical transmitting and/or receiving module comprises an optical plug comprising a housing which is provided with at least one ferrule assembly having an optical fiber therein, a main receptacle body connected to the optical plug, and an optical link assembly comprising a substrate. The substrate has at least one optical semiconductor element and circuit elements for signal processing fixed thereon. The optical link assembly is fixed to the main receptacle body so that the at least one optical semiconductor element opposes a tip end of the optical fiber of the optical plug and a surface of the substrate is perpendicular to an optical axis of the optical fiber.

Optical transmitting and/or receiving module

Growing community of inventors

Atsugi, Japan

Jiro Nakano