Tokyo Ohka Kogyo Co., Ltd.

Daicel Corporation

Jiro Hikida

Dai Shiota

Koichi Misumi

Kazuya Someya

Tsutomu Watanabe

Kunihiro Noda

Hiroki Chisaka

Kazuhiro Uehara

Issei Suzuki

Kyohei Ishida

Hideki Saijo

Kieko Hanano

Hiroyuki Kikuchi

A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xrepresents an m valent counter cation, Rrepresents an aromatic group which may have a substituent; Rrepresents an alkylene group which may have a substituent; Rrepresents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and Rmay bond with Rto form a cyclic structure.

Compound, epoxy curing catalyst and method for producing compound

A resin composition resulting in a cured article which is excellent in balance among mechanical strength, surface smoothness, and light transmittance, a method for producing a cured article, a cured article, and a flexible substrate or flexible display including the cured article. The resin composition includes a polyamic acid having a structural unit represented by the following formula (1), a cellulose compound having a weight average molecular weight of 60,000 or less, and an organic solvent. In the formula (1), A is a tetravalent organic group and B is a divalent organic group.

Resin composition, method for producing cured article, cured article, flexible substrate, and flexible display

An aromatic amine compound capable of satisfactorily forming a cured product having exceptional alkali resistance by reaction with an epoxy compound; a curing agent for an epoxy compound, the curing agent including the aromatic amine compound; a curable composition including the curing agent for an epoxy compound; a cured product of the curable composition; a method for producing the cured product; and a method for producing the abovementioned aromatic amine compound. The aromatic amine compound has a structure such that a specific position in a central skeleton comprising a fused ring such as a fluorene ring is substituted with a side-chain group including two aromatic groups linked by a flexible bond such as an amide bond, at least one amino group is bonded to the end of the side-chain group, and the structure has no hydroxyl groups.

Aromatic amine compound, curing agent for epoxy compound, curable composition, cured product, method for producing cured product, and method for producing aromatic amine compound

A hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the composition; and an electronic element provided with the hydrogen barrier film. A salt compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. The composition is prepared by blending the hydrogen barrier agent into the base material component. The hydrogen barrier film is formed using the hydrogen barrier film forming composition.

Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element

To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.

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Kawasaki, Japan

Jiro Hikida