Asahi Glass Company, Limited

Nippon Gakki Seizo Kabushiki Kaisha

Asahi Techno Glass Corporation

Iwaki Glass Co., Ltd.

Sekogiken

Jiro Chiba

Yoshinori Kokubu

Tsuneo Manabe

Mitsuo Takabatake

Yoshiro Suzuki

Keiichi Kawakami

Kazuhiro Ito

Itsuki Bahn

Naoki Sugimoto

Hitoshi Onoda

Setsuro Ito

Kazunari Watanabe

Hiroshi Usui

Ryuichi Tanabe

Yasuko Osaki

Toshiyasu Kawaguchi

Katsuyoshi Nakayama

Ryoji Akiyama

Atsuo Hiroi

Eiji Ichikura

Shuji Taguchi

Masaya Matsunaga

Shigehiro Nagahara

Nobuyoshi Ichimura

Kozo Saita

Takaji Shimosaka

Mineyuki Ishida

Syuji Taguchi

Kenji Mukai

Ryosuke Sugiura

Masahiko Ishiyama

Morihisa Hara

Koichi Yamamoto

Takashi Iwai

To provide a process for producing a reliable substrate in good yield, by suppressing bleeding of boric acid from a green sheet comprising a powder of borosilicate glass to improve printability of a conductive pattern thereby to prevent disconnection. A process for producing a substrate which comprises firing a green sheet comprising a powder of borosilicate glass, wherein the powder is one prepared by holding borosilicate glass before pulverization, at a temperature higher by at least 30&#xb0; C. than the glass transition temperature and lower by at most 50&#xb0; C. than the softening point of the borosilicate glass for at least 3 hours in the atmosphere, followed by pulverization.

Process for producing substrate

A non-lead glass for forming a dielectric, which consists essentially of, as represented by mol %, from 20 to 39% of SiO, from 5 to 35% of BO, from 2 to 15% of AlO, from 1 to 25% of CaO+SrO, from 5 to 25% of BaO, from 0 to 35% of ZnO, and from 0 to 10% of TiO+ZrO+SnO, provided that BO+ZnO is from 15 to 45%, and which does not contain alkali metal oxides, or contains such oxides in a total amount within a range of less than 1%. Further, a glass ceramic composition for forming a dielectric, which consists essentially of a Ba-containing compound powder and a powder of the above mentioned non-lead glass for forming a dielectric. Further, a dielectric obtained by firing the above glass ceramic composition for forming a dielectric.

Non-lead glass for forming dielectric, glass ceramic composition for forming dielectric, dielectric, and process for producing laminated dielectric

A barium borosilicate glass which consists essentially of, as represented by mass% based on the following oxides:

Barium borosilicate glass and glass ceramic composition

A ceramic color composition which comprises from 5 to 40 wt % of a heat-resistant color pigment powder, from 50 to 94.5 wt % of a glass powder, from 0 to 25 wt % of a refractory filler, and from 0.1 to 40 wt % of at least one whisker-like refractory filler selected from the group consisting of aluminum borate whiskers, &agr;-alumina whiskers, potassium titanate whiskers, zinc oxide whiskers, Na,Ca,P,O,whiskers, magnesium oxide whiskers, magnesium borate whiskers, basic magnesium sulfate (MgSO,.5MgO.8H,O) whiskers and titanium diboride whiskers.

Ceramic color composition and process for producing a curved glass plate

A plasma display panel comprising mutually opposing substrates and barrier ribs formed between adjacent pixels of a display between the substrates, wherein the barrier ribs are made of a fired product of a glass ceramic composition consisting essentially of a glass powder of P.sub.2 O.sub.5 type glass and a low expansion ceramic powder.

Plasma display panel

A colored ceramic composition comprising, as inorganic components, from 55 to 75% by weight of a glass powder, from 1 to 17% by weight of a metal powder, from 1 to 25% by weight of a scale-like refractory filler and from 13 to 30% by weight of a heat-resistant coloring pigment.

Colored ceramic composition and method for producing glass plate using

A process of forming a glass sheet by coating a portion of a glass sheet with a ceramic color paste, then forming a silver paste over a portion of the ceramic color paste and then firing the sheet. The ceramic color paste is of a composition which prevents the migration of silver ions to the glass plate during the firing. Migrated silver ions causes discoloration in the glass. The ceramic color composition comprising, as inorganic components, from 40 to 95 wt % of a glass powder, from 4 to 40 wt % of a heat resistant pigment powder and from 1 to 30 wt % of a boride, a nitride, a carbide, lead sulfide or a mixture thereof.

Process for producing a glass sheet with a ceramic color composition and

A process for producing a curved glass plate, which comprises coating a crystallizable ceramic color composition to a predetermined portion of a glass plate, followed by baking at a temperature of from 500.degree. to 620.degree. C. to fuse the ceramic color composition to the glass plate, then crystallizing the fused ceramic color composition at a temperature of from 600.degree. to 700.degree. C., followed by bend-shaping by a pressing apparatus in a furnace.

Process for producing a curved glass plate partially coated with a

Drive system and a control unit therefor

A hermetic sealing glass composition comprising an inorganic component which consists essentially of from 60 to 100 wt % of a glass powder, from 0 to 30 wt % of a filler and from 0 to 10 wt % of a pigment, wherein said glass powder consists essentially of from 30 to 45 wt % of SiO.sub.2, from 11 to 25 wt % of Al.sub.2 O.sub.3, from 11 to 25 wt % of ZnO, from 11 to 25 wt % of B.sub.2 O.sub.3, from 0.05 to 10 wt % of ZrO.sub.2, from 0.1 to 10 wt % of at least one of La.sub.2 O.sub.3, from 0.1 to 7 wt % of BaO, SrO, or CaO+MgO, from 0.1 to 7 wt % of at least one Li.sub.2 O, +Na.sub.2 or K.sub.2 O, from 0.1 to 5 wt % of at least one CeO.sub.2, +TiO.sub.2 or SnO.sub.2, from 0 to 5 wt % of PbO and from 0 to 5 wt % of at least one metal oxide selected from the group consisting of oxides of Co, Ni, Cr, Mn, Fe and Cu.

Hermetic sealing glass composition

A composition for a ceramic substrate comprising from 30 to 70% by weight of glass powder, from 28 to 70% by weight of refractory filler powder and an oxidizing agent, said glass powder consisting essentially of from 38 to 48% by weight of SiO.sub.2, from 1 to 8% by weight of Al.sub.2 O.sub.3, from 0 to 10% by weight of MgO, from 18 to 28% by weight of BaO, from 1 to 8% by weight of CaO, from 0 to 15% by weight of SrO, from 0.5 to 15% by weight of B.sub.2 O.sub.3, from 0 to 20% by weight of PbO, from 10 to 20% by weight of ZnO, from 0 to 7% by weight of TiO.sub.2 plus ZrO.sub.2 and from 0 to 5% by weight of Li.sub.2 O plus Na.sub.2 O plus K.sub.2 O, and said refractory filler powder comprising from 20 to 60% by weight of alumina, from 0 to 40% by weight of zircon, from 0 to 30% by weight of cordierite and from 0 to 30% by weight of forsterite.

Composition for ceramic substrate and substrate

A process for producing a porous glass which comprises forming a shaped product of borosilicate glass having a predetermined shape, heat-treating the shaped product for phase separation to form a silica rich insoluble phase and an alkali and boric oxide rich soluble phase, leaching out the soluble phase from the insoluble phase with an acid or an alkali to obtain a porous glass, wherein said shaped product of borosilicate glass is composed essentially of from 45 to 67% by weight of SiO.sub.2, from 0.5 to 10% by weight of Al.sub.2 O.sub.3, from 10 to 30% by weight of B.sub.2 O.sub.3, from 0.5 to 8% by weight of Na.sub.2 O, from 0.1 to 8% by weight of K.sub.2 O+Li.sub.2 O+Cs.sub.2 O, from 0.5 to 7% by weight of CaO, from 0.5 to 15% by weight of MgO+BaO+SrO, from 0 to 10% by weight of ZrO.sub.2 +TiO.sub.2 and from 0.03 to 3% by weight of F+SO.sub.3 +Cl+As.sub.2 O.sub.3 +Sb.sub.2 O.sub.3.

Porous glass, process for its production and glass material used for the

A ceramic composition for a multilayer printed wiring board, consisting essentially of from 35 to 95% by weight of glass powder and from 5 to 65% by weight of refractory filler powder, said refractory filler powder being at least one member selected from the group consisting of .alpha.-quartz, corundum, zircon and zirconia and said glass powder consisting essentially of from 25 to 40% by weight of SiO.sub.2, from 4 to 15% by weight of Al.sub.2 O.sub.3, from 15 to 25% by weight of B.sub.2 O.sub.3, from 15 to 40% by weight of BaO+CaO+MgO, from 1 to 10% by weight of ZnO and from 0.5 to 5% by weight of ZrO.sub.2.

Ceramic composition for multilayer printed wiring board

A composition for a multilayer printed wiring board, consisting essentially of from 25 to 65% by weight of glass powder, from 0 to 60% by weight of alumina powder and from 5 to 60% by weight of forsterite powder, said glass powder consisting essentially of from 25 to 70% by weight of SiO.sub.2, from 4 to 15% by weight of Al.sub.2 O.sub.3, from 25 to 45% by weight of B.sub.2 O.sub.3 and from 0.5 to 30% by weight of BaO.

Composition for multilayer printed wiring board

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Yokohama, Japan

Jiro Chiba